Method and system for wireless communication utilizing leaky wave antennas on a printed circuit board

Abstract

Methods and systems for wireless communication utilizing leaky wave antennas (LWAs) on a printed circuit board are disclosed and may include communicating RF signals via LWAs in an integrated circuit (chip) and/or package in a wireless device to LWAs in a printed circuit board in the wireless device. RF signals may then be communicated via the LWAs in the printed circuit board to external devices, and may communicated vertically or at a desired angle from the surface. The RF signals may be communicated between regions within the printed circuit board. The LWAs may include microstrip or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The chip may be flip-chip-bonded to an package which may be affixed to a printed circuit board. A pair of the plurality of LWAs may be stacked to communicate signals in opposite directions.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS / INCORPORATION BY REFERENCE[0001]This application makes reference to, claims the benefit from, and claims priority to U.S. Provisional Application Ser. No. 61 / 246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61 / 185,245 filed on Jun. 9, 2009.[0002]This application also makes reference to:U.S. patent application Ser. No. 12 / 650,212 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,295 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,277 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,192 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,224 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,176 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,246 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,292 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,324 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 708,36...

AI Technical Summary

Benefits of technology

[0010]A system and / or method for wireless communication utilizing leaky wave antennas on a printed circuit board as shown in and / or described in connection with at least one of the figures, as set forth more completely in the claims.

Problems solved by technology

Additionally, transmit and / or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices.

Moreover, in some conventional communication systems, transmitters and / or receivers are often power inefficient in comparison to other blocks of the portable communication devices.

Images