Liquid-cooled-type cooling device
a cooling device and liquid cooling technology, applied in semiconductor devices, lighting and heating apparatus, tubular elements, etc., can solve the problem of limiting achieve the effect of improving cooling performance, improving cooling performance, and improving cooling performan
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[0032]An embodiment of the present invention will next be described with reference to the drawings. Notably, throughout the drawings, like portions and like members are indicated by like reference numerals, and repeated descriptions are omitted.
[0033]In the following description, the upper, lower, left-hand, and right-hand sides of FIG. 2 will be referred to as “upper,”“lower,”“left,” and “right,” respectively. Further, the lower and upper sides of FIG. 3 will be referred to as “front” and “rear,” respectively.
[0034]In the following description, the term “aluminum” encompasses aluminum alloys in addition to pure aluminum.
[0035]FIGS. 1 to 3 show the overall structure of a liquid-cooled-type cooling device according to the present invention; and FIGS. 4 and 5 show the structure of a main portion of the cooling device. Notably, FIGS. 1 to 3 show a state in which a heat-generating body composed of a semiconductor device is mounted on the liquid-cooled-type cooling device of the present ...
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