Heat pump system
a heat pump and peltier technology, applied in the direction of heat pumps, lighting and heating apparatus, machine operation modes, etc., can solve the problems of low thermal conductivity of resin cases, inability to easily radiate cold inability to easily radiate heat from indoor heat mediums into the air, etc., to achieve improved heat pump efficiency and low thermal conductivity , the effect of low thermal conductivity
Inactive Publication Date: 2012-09-27
TOYOTA IND CORP
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Benefits of technology
[0008]The metal case exhibits high thermal conductivity (heat conductivity) because the metal case is formed of metal. And the resin case exhibits low thermal conductivity because the resin case is formed of resin. Accordingly, the efficiency of the heat pump due to the Peltier element is improved. That is, for the purpose of heating, an electric current is supplied to the Peltier element, using the first substrate sides of the Peltier element as a heat-absorbing portion and the second substrate sides thereof as a heat-radiating portion. The heat-absorbing portion of the Peltier element absorbs heat from an outdoor heat medium in the first flow path of the metal case via the first substrate. The outdoor heat medium absorbs heat from the air in the outdoor space via the metal case. Thus, the heat of the air in the outdoor space is utilized to improve the heat pump performance due to the Peltier element. On the other hand, the heat-radiating portion of the Peltier element supplies heat to an indoor heat medium in the second flow path of the resin case via the second substrate. The heat supplied to the indoor heat medium is not easily radiated into the air in the outdoor space due to the low thermal conductivity of the resin case. In comparison to the metal case, the resin case allows a smaller quantity of heat to be radiated. As a result, the quantity of heat supplied to the indoor heat exchange unit is increased, thus achieving an improvement in terms of heating efficiency.
[0009]During cooling, an electric current is supplied to the Peltier element, using the first substrate sides of the Peltier element as a heat-radiating portion and the second substrate sides as a heat-absorbing portion. The heat-radiating portion of the Peltier element radiates heat to the outdoor heat medium in the first flow path of the metal case via the first substrate. The outdoor heat medium radiates heat to the air in the outdoor space via the metal case. Thus, the heat is radiated to the air in the outdoor space, whereby the heat pump performance due to the Peltier element is improved. Conversely, the heat-absorbing portion of the Peltier element absorbs heat from the indoor heat medium in the second flow path of the resin case via the second substrate, thereby supplying cold to the indoor heat medium. The cold supplied to the indoor heat medium is not easily radiated to the air in the outdoor space due to the low thermal conductivity of the resin case. In comparison to the metal case, the resin case allows a smaller quantity of cold to be radiated. As a result, the quantity of cold supplied to the indoor heat exchange unit increases, resulting in improved air-conditioning efficiency.
Problems solved by technology
And the resin case exhibits low thermal conductivity because the resin case is formed of resin.
The heat supplied to the indoor heat medium is not easily radiated into the air in the outdoor space due to the low thermal conductivity of the resin case.
The cold supplied to the indoor heat medium is not easily radiated to the air in the outdoor space due to the low thermal conductivity of the resin case.
Method used
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[0016]Each of the additional features and teachings disclosed above and below may be utilized separately or in conjunction with other features and teachings to provide improved heat pump systems. Representative examples of the present invention, which examples utilize many of these additional features and teachings both separately and in conjunction with one another, will now be described in detail with reference to the attached drawings. This detailed description is merely intended to teach a person of skill in the art further details for practicing preferred aspects of the present teachings and is not intended to limit the scope of the invention. Only the claims define the scope of the claimed invention. Therefore, combinations of features and steps disclosed in the following detailed description may not be necessary to practice the invention in the broadest sense, and are instead taught merely to particularly describe representative examples of the invention. Moreover, various fe...
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One aspect of the present invention may include a heat pump system having a Peltier unit in an outdoor space and an outdoor heat exchange unit in the outdoor space. The Peltier unit has a Peltier element with a heat-absorbing portion and a heat-radiating portion, a first substrate in contact with the heat-absorbing portion, a second substrate in contact with the heat-radiating portion, a metal case and a resin case. The metal case covers the first substrate and forms a first flow path between itself and the first substrate. The first flow path is connected in a loop-like fashion to the outdoor heat exchange unit by an outdoor piping. The resin case covers the second substrate and forms a second flow path between itself and the second substrate. The second flow path is connected in a loop-like fashion to the indoor heat exchange unit by an indoor piping.
Description
[0001]This application claims priority to Japanese patent application serial number 2011-62268, the contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat pump system utilizing a Peltier element.[0004]2. Description of the Related Art[0005]Japanese Patent Application Laid-Open No. 2009-36852 discloses an apparatus containing a Peltier element, a metal plate held in contact with one end portion of the Peltier element, an apparatus main body mounted to the metal plate, a casing covering the apparatus main body in cooperation with the metal plate, a heat sink held in contact with the other end portion of the Peltier element and a duct covering the heat sink. When an electric current is passed through the Peltier element, the metal plate side of the Peltier element becomes a heat-absorbing portion, while the heat sink side thereof becomes a heat-radiating portion. The heat-absorbing p...
Claims
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Login to View More IPC IPC(8): F25B21/02
CPCF25B21/02F25B2321/023B60L2270/46B60L1/003F25B2321/025F25B30/02H10N10/10
Inventor UEDA, HIROMIYOKOMACHI, NAOYAOKUDA, MOTOAKINAKAMURA, JUNKI
Owner TOYOTA IND CORP