High Density Optical Packaging Header Apparatus
- Application Information
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Problems solved by technology
The apparatus of the present invention advantageously overcomes and address the drawbacks of previously known solutions for simultaneously connecting multiple optical fibers / waveguides to optical-fiber-based systems, components, and devices, and provides additional beneficial features.
Specifically, the inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers / waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers / waveguides assembled in a header block configuration to optical-fiber-based system / component backplanes, while providing advantageous active and passive alignment features.
Before describing the various exemplary embodiments of the present invention, the term “w...
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