High Density Optical Packaging Header Apparatus

Inactive Publication Date: 2012-10-11
CHIRAL PHOTONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0013]The present invention is directed to an inventive high density optical packaging header apparatus that, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, compo

Problems solved by technology

Such requirements pose significant challenges due at least in part to:the necessity of precise passive and active alignment of the connections (which is exacerbated when the connection involves multiple geometrically dispersed fibers/waveguides),the inherent fragility of optical fibers/waveg

Method used

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Embodiment Construction

[0015]The apparatus of the present invention advantageously overcomes and address the drawbacks of previously known solutions for simultaneously connecting multiple optical fibers / waveguides to optical-fiber-based systems, components, and devices, and provides additional beneficial features.

[0016]Specifically, the inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers / waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers / waveguides assembled in a header block configuration to optical-fiber-based system / component backplanes, while providing advantageous active and passive alignment features.

[0017]Before describing the various exemplary embodiments of the present invention, the term “w...

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Abstract

The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present patent application claims priority from the commonly assigned co-pending U.S. provisional patent applications, Ser. No. 61 / 433,852, entitled “High Density Optical Packaging Header Apparatus”, filed Apr. 8, 2011.FIELD OF THE INVENTION[0002]The present invention relates generally to couplers and connectors for connecting multiple optical fibers / waveguides to optical-fiber-based electronic systems and components, and more particularly to a versatile optical packaging header apparatus that is readily configurable for use in a variety of applications involving highly flexible and modular connection of multiple optical fibers / waveguides assembled in a header block configuration to optical-fiber-based system / component / device backplanes, while providing advantageous active and passive alignment features.BACKGROUND OF THE INVENTION[0003]There are many applications in the field of electronic / optical systems, which require simultaneous c...

Claims

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Application Information

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IPC IPC(8): G02B6/38
CPCG02B6/3636G02B6/4214G02B6/3668G02B6/3644
Inventor KOPP, VICTOR IL'ICHSINGER, JONATHANNEUGROSCHL, DANIEL
Owner CHIRAL PHOTONICS
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