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Heat sink

Inactive Publication Date: 2013-06-13
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is aimed at providing a heat sink that can enhance heat dissipation for partially placed heating devices.

Problems solved by technology

Recently, due to an increase in energy usage and an increase in inefficiency according to miniaturization / integration, a heat radiation problem has been caused in a power module.
However, since an increase in efficiency through a complicated structure causes an increase in a production cost, a simple and high efficiency heat radiation structure needs to be designed.
However, in the heat sink according to the prior art as described above having a structure of lowering the overall temperature of the power module, it is difficult to effectively lower temperatures of partially disposed heating devices.

Method used

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Embodiment Construction

[0035]Various features and advantages of the present invention will be more obvious from the following description with reference to the accompanying drawings.

[0036]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.

[0037]The above and other objects, features and advantages of the present invention will be more clearly understood from preferred embodiments and the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numeral...

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Abstract

Disclosed herein is a heat sink including: a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and a case enclosing the pipe for refrigerant movement.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2011-0133190, filed on Dec. 12, 2011, entitled “Heat Sink”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a heat sink.[0004]2. Description of the Related Art[0005]Recently, due to an increase in energy usage and an increase in inefficiency according to miniaturization / integration, a heat radiation problem has been caused in a power module.[0006]Since this heat radiation problem has an effect on a lifespan of a component as well as a simple temperature problem, several methods for solving the heat radiation problem have been suggested.[0007]However, since an increase in efficiency through a complicated structure causes an increase in a production cost, a simple and high efficiency heat radiation structure needs to be designed.[0008]In addition, a b...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28F13/08F28F1/04H01L23/467H01L23/473H01L2924/0002H01L2924/00F28D15/02H05K7/20
Inventor OH, KYU HWANHONG, CHANG SEOBKWAK, YOUNG HOON
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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