Coaxial plated through holes (PTH) for robust electrical performance

Abstract

In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. in this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed.

Description

PRIORITY APPLICATION[0001]This application is a divisional of U.S. application Ser. No. 12 / 347,600, filed Dec. 31, 2008, which is incorporated herein by reference.FIELD OF THE INVENTION[0002]Embodiments of the present invention generally relate to the field of integrated circuit package design and, more particularly, to coaxial plated through holes (PTH) for robust electrical performance.BACKGROUND OF THE INVENTION[0003]As integrated circuit architecture core count continues to scale up in accordance to Moore's law, the need for high I / O bandwidth and fully integrated voltage regulator design is critical to improve performance. The capacitance between the large plated through holes via pads and surrounding metal bodies causes return loss during high speed data transfer and in addition provides a low quality factor for fully integrated voltage regular designs. While ultra small plated through holes can help improve the return loss, they are currently very costly to manufacture using ...

AI Technical Summary

Benefits of technology

This solution enhances electrical performance by reducing return loss and improving quality factors while reducing manufacturing costs through efficient use of materials and advanced drilling techniques.

Problems solved by technology

The capacitance between the large plated through holes via pads and surrounding metal bodies causes return loss during high speed data transfer and in addition provides a low quality factor for fully integrated voltage regular designs.

While ultra small plated through holes can help improve the return loss, they are currently very costly to manufacture using mechanical drilling process.

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