Heat dissipating device

Abstract

A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to a heat dissipating device and, more particularly, to a loop-heat-pipe type heat dissipating device.[0003]2. Description of the Prior Art[0004]Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.[0005]So far the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat dissipating fan, wherein one end of the heat pipe contacts the electronic component, which generates heat during operation, the other end of the heat...

AI Technical Summary

Benefits of technology

The invention is a heat dissipating device that has a heat sink on the outer wall of a chamber body. The heat sink covers both the compensation chamber and the pipe of the invention, improving heat dissipating efficiency. The vapor channels and compensation chamber are isolated using a capillary structure, preventing vapor from flowing back and reducing pressure difference between the chambers. The invention also utilizes a vapor collecting space to enhance heat dissipating efficiency. Overall, the invention improves the heat dissipating efficiency of the heat dissipating device.

Problems solved by technology

When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance.

If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat.

Therefore, the performance of heat dissipating device is a significant issue for the electronic product.

However, since heat generated by the electronic component increases per unit time while calculation speed of the electronic component increase, the conventional heat dissipating device cannot dissipate heat effectively form the electronic component such that heat will be accumulated in the electronic component accordingly.

Therefore, how to dissipate heat from the electronic component much more rapidly becomes a significant issue while designing the heat dissipating device.

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