Thermal module structure

Abstract

A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to an improved thermal module structure, and more particularly to a thermal module structure having lower thermal resistance and able to provide much better heat dissipation effect. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.[0003]2. Description of the Related Art[0004]Following the continuous advance of sciences and technologies, the sizes of electronic products have become smaller and smaller, while the power consumption and the heat generated by the electronic products have become greater and greater. In order to keep the electronic components stably operating, the heat must be dissipated at high efficiency.[0005]Please refer to FIGS. 1A and 1B. FIG. 1A is a perspective exploded view of a conventional thermal module 1. FIG. 1B is a perspective assembled view of the conventio...

AI Technical Summary

Benefits of technology

The present invention provides an improved thermal module structure with lower thermal resistance and better heat dissipation effect. It also reduces manufacturing costs and time. The heat is quickly dissipated from the radiating fins of the extension section, which has a low thermal conductivity. The main body of the thermal module structure is integrally formed, which simplifies the manufacturing process.

Problems solved by technology

Such soldering process takes much time and leads to increase of manufacturing cost.

1. The manufacturing cost is increased.

2. It takes much time to manufacture the thermal module.

3. The heat dissipation is slowed down.

Images