Rigid substrate, touch panel, and processing method of rigid substrate

Abstract

A rigid substrate, a touch panel including the rigid substrate, and a processing method of the rigid substrate are provided. The rigid substrate includes an ion strengthened surface layer completely covering the entire outer surface thereof. The rigid substrate has an etched wall, wherein an average depth of the ion strengthened surface layer on the etched wall is substantially equivalent to an average depth of the ion strengthened surface layer outside of the etched wall.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 101119366, filed on May 30, 2012. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND[0002]1. Field of the Invention[0003]The invention relates to a substrate, a touch panel, and a processing method of the substrate. More particularly, the invention relates to a rigid substrate, a touch panel including the rigid substrate, and a processing method of the rigid substrate.[0004]2. Description of Related Art[0005]As probabilities for users to be in direct contact with panel devices significantly increase, possibilities of damaging the panel devices due to lack of mechanical strength may also increase. Therefore, the mechanical strength of the panel devices has become an important factor in indicating a durability of electronic products. Currently, a strengthened substrate (...

AI Technical Summary

Benefits of technology

The invention provides a rigid substrate with etched walls that have uniformed cracks, which results in ideal mechanical strength. This strengthened substrate can be used for a touch panel, providing better quality and durability. Additionally, the invention provides a processing method for the rigid substrate that effectively avoids stress concentration phenomenon on the wall of the substrate after cutting. The resulting etched wall has smaller average surface roughness and is less likely to produce a stress concentration phenomenon at specific areas. A chemical strengthening process is performed after the mechanical processed rigid substrate parison is being etched, which provides a stable product strength.

Problems solved by technology

As probabilities for users to be in direct contact with panel devices significantly increase, possibilities of damaging the panel devices due to lack of mechanical strength may also increase.

Nevertheless, the strengthened substrate generally has to undergo a process of cutting and forming so as to comply with a designed size of a product, a plurality of cracks with different sizes are produced at cut-off edges during the process of cutting and forming, and the cracks with different sizes often become stress concentration areas.

Therefore, the aforementioned substrate still has some limits as in enhancing the mechanical strength of the panel devices; and especially, the substrate often starts to crack from the cut-off edges.

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