Method for adjusting height position of polishing head and method for polishing workpiece
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[0056]The present invention will now be described more specifically with reference to an example according to the present invention and a comparative example, but the present invention is not limited to this example.
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[0057]A workpiece was polished in accordance with a method for adjusting a height position of a polishing head and a method for polishing a workpiece of the present invention, and then the flatness thereof was evaluated.
[0058]A polishing apparatus as illustrated in FIG. 1 having a polishing head by the rubber-chuck method as illustrated in FIG. 2 was used to polish 100 silicon wafers each having a diameter of 300 mm. The maximum value, the minimum value, and the average value of the flatness, and variation in the flatness of each polished wafer were then evaluated. The flatness was evaluated by global backside ideal range (GBIR) within a region except for the outer circumferential part of 2 mm using Wafersight made by KLA Co. Ltd.
[0059]First, the height po...
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