Electro-copper plating apparatus

Inactive Publication Date: 2014-03-13
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]An object of the present invention is to provide a novel electro-copper plating apparatus capable of replacing the electro-copper plating apparatus u

Problems solved by technology

However, in the case of CuO, an efficiency of supplementing CuO is deteriorated due to an introduction of inorganic and organic impurities, and in the case of Fe3+, there is a lim

Method used

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Embodiment Construction

[0024]Hereinafter, the present invention will be described in detail.

[0025]Terms used in the present specification are for explaining the embodiments rather than limiting the present invention. Unless explicitly described to the contrary, a singular form includes a plural form in the present specification. The word “comprise” and variations such as “comprises” or “comprising,” will be understood to imply the inclusion of stated constituents, steps, operations and / or elements but not the exclusion of any other constituents, steps, operations and / or elements.

[0026]The present invention relates to an electro-copper plating apparatus using an insoluble anode. The electro-copper plating apparatus according to a preferred embodiment of the present invention is shown in FIG. 3.

[0027]Referring to FIG. 3, in the electro-copper plating apparatus, a cathode 111, an insoluble anode 112, a copper ball 115, and a plating solution 113 are included in a single bath 110, wherein the plating solution...

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Abstract

Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-copper plating apparatus including: a main bath including a cathode, an insoluble anode, and a plating solution; and a dissolution bath including a copper ball, and manganese oxide. According to the present invention, the manganese oxide having higher oxidation-reduction potential instead of using Fe3+ of the related art as the copper source in the electro-copper plating apparatus may be used to obtain a high effect in suppressing surface plating even at a low concentration.

Description

CROSS REFERENCE(S) TO RELATED APPLICATIONS[0001]This application claims the benefit under 35 U.S.C. Section 119 of Korean Patent Application Serial No. 10-2012-0100969, entitled “Electro-Copper Plating Apparatus” filed on Sep. 12, 2012, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to an electro-copper plating apparatus.[0004]2. Description of the Related Art[0005]An insoluble anode is used to minimize a foreign material when melting and using copper (Cu) in an electro-copper plating method. The electro-copper plating method using the insoluble anode may be largely classified into two methods according to a scheme of supplying the copper, that is, a method of supplementing CuO with a plating solution and a method of dissolving Fe3+ ion in the plating solution to supply a copper ion to a main bath.[0006]FIG. 1 shows an electro-copper plating apparatus using an inso...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38C25D17/10C25D21/18C25D17/00
Inventor NAM, HYO SEUNGKIM, MI GEUM
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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