Circuits, methods, and computer programs to detect mechanical stress and to monitor a system

Abstract

Embodiments provide a circuit, a method, and a computer program configured to detect mechanical stress and a circuit, a method, and a computer program configured to monitor safety of a system. The detection circuit is configured to monitor a mechanical stress level of a semiconductor circuit. The detection circuit comprises a stress monitor module configured to monitor a signal comprising mechanical stress level information of the semiconductor circuit, a reference module to generate a reference signal, and a calibration module configured to modify at least one of the stress signal or the reference signal based on calibration information for the semiconductor circuit to obtain a at least one modified signal. The detection circuit further comprises an activation signal generator configured to generate an activation signal comprising activation information related to the mechanical stress level of the semiconductor circuit depending on a relation between the modified signal, and the stress signal or the reference signal.

Description

REFERENCE TO RELATED APPLICATION[0001]This Application is a Continuation-in-Part of U.S. application Ser. No. 13 / 963,341 filed on Aug. 9, 2013, the contents of which are incorporated by reference in their entirety.FIELD[0002]Embodiments relate to circuits, methods, and computer programs configured to detect mechanical stress and configured to monitor a safety of a system.BACKGROUND[0003]Electronic circuits and semiconductors are increasingly used in manifold applications. At the same time, complexity of these circuits and of overall applications increases as well. With the introduction of more and more electronic circuits and semiconductors into applications safety issues arise. For example, systems or applications used in mass or public transportation, as well as in automotive and aviation, are relevant for a safe operation of the respective vehicle. Safety or reliability of these systems and applications may determine the safety of the respective users. International organizations...

AI Technical Summary

Benefits of technology

The patent describes a stress monitoring system for semiconductor circuits that uses a sensor to measure mechanical stress and provide calibration information. The system can then use this information for multiple purposes, such as measuring the accuracy of other sensors or detecting and responding to critical stress levels. The system can also compare signals from different sensors and generate an activation signal if a mechanical stress level indicated by multiple signals exceeds a certain threshold. Overall, the patent enables a more efficient and effective way to monitor and respond to stress on semiconductor circuits.

Problems solved by technology

At the same time, complexity of these circuits and of overall applications increases as well.

With the introduction of more and more electronic circuits and semiconductors into applications safety issues arise.

Stress resistant housing may lead to significant cost adders compared to standard packages.

Efforts, for example in terms of measurement circuitry and stress sensors, may generate extra costs.

In some applications high accuracy of the measurements may be used and correction may be limited to a normal operating range of the respective circuit or semiconductor at which the measurements are carried out and compensated.

If a defined operating range is exceeded significantly the accurate stress compensation of measurement circuitry may fail and lead to wrong calculations, disadvantageous or potentially dangerous effects.

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