Multi-compartment computing device with shared cooling device

Abstract

Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Description

BACKGROUND OF THE DISCLOSURE[0001]This invention relates generally to electronic devices, and more particularly to computing device enclosures and thermal management systems for computing devices.[0002]Many types of conventional computers consist of a one or more circuit boards housed with an enclosure or case. ATX and microATX represent some conventional standard case sizes. A few conventional case designs incorporate two side-by side compartments or sometimes vertically stacked compartments. In many conventional designs, thermal management is provided by a heat sink or spreader and a cooling fan. However, some conventional computers generate more heat than can be adequately managed by air flow alone. These designs often resort to a liquid cooling system.[0003]Several technical issues are presented by conventional liquid cooling and case designs. Many conventional liquid cooling systems employ multiple radiators. The placement of these multiple radiators is normally driven by whate...

AI Technical Summary

Benefits of technology

The present invention provides a computing device enclosure with a first compartment for housing the computing device and a liquid cooling device, and a second compartment for housing a heat exchanger to remove heat transferred to the liquid cooling device. The two compartments are connected by a hub so as to leave a gap between the first and second upper sides. The invention also provides a method for thermally managing a computing device with a first heat generating component by placing it in the first compartment of the enclosure and connecting it to the liquid cooling device in the second compartment through the hub. The technical effects of the invention include improved cooling efficiency, reduced heat transfer to the enclosure, and improved thermal management.

Problems solved by technology

However, some conventional computers generate more heat than can be adequately managed by air flow alone.

Several technical issues are presented by conventional liquid cooling and case designs.

These standard form factors do not allow the most efficient use of space.

In addition, typical conventional liquid cooling systems using standard components tend to be relatively large and do not allow for much customization or implementation of unique form factors.

This preheating reduces the efficacy of the radiator.

This leads to higher system complexity and size since these various cold plates must be routed together via a tubing network within the system.

These networks of cold plates are not optimized to fit within a system enclosure and therefore leads to wasted space and greater assembly complexity within the system enclosure.

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