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Epoxy resin composition

a technology of epoxy resin and composition, which is applied in the field of epoxy resin composition, can solve the problems of poor handling property and storage stability of epoxy resin compositions containing curing accelerators, and its molding may become difficult, so as to improve the storage stability of epoxy resin compositions, improve handling properties, and improve the effect of latency

Active Publication Date: 2018-05-03
NISSHINBO CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention improves the storage stability of epoxy resin without affecting its cured resin characteristics by using a curing accelerator with higher latency. Additionally, the handling property of the epoxy resin composition is improved for processing purposes.

Problems solved by technology

50° C., and its molding may become difficult.
As described above, the epoxy resin composition containing a curing accelerator has been inferior in terms of handling property and also storage stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0087]Onto an aluminum dish, 100 parts by mass of an epoxy resin (jER828; produced by Mitsubishi Chemical Corporation), and as a curing agent 54.2 parts by mass of a phenolic resin (BRG556; produced by Showa Denko K.K.) were placed and mixed with stirring with a fluorocarbon resin rod for 1 min on a hot plate at 130° C. The curing accelerator 2PZ-cb1 synthesized above was added thereto so that the content of the imidazole compound component reached 1 part by mass, and the mixture was stirred with a fluorocarbon resin rod for 5 min on a hot plate at 50° C. to prepare an epoxy resin composition.

examples 2 to 9

[0088]Epoxy resin compositions were prepared identically with Example 1 except that the respective curing accelerators shown in Table 1 were used.

reference example 1

[0116]In a plastic container, 100 parts by mass of an epoxy resin (jER828; produced by Mitsubishi Chemical Corporation), and the curing accelerator 2PZ-cb1 synthesized as above were placed so that the content of the imidazole compound component reached 1 part by mass, and mixed for 10 min with a planetary mixing and deaerating apparatus (MAZERUSTAR KK-400W; produced by Kurabo Industries Ltd.) to prepare an epoxy resin composition.

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Abstract

The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

Description

TECHNICAL FIELD[0001]The present invention relates to an epoxy resin composition to be used favorably as a semiconductor sealing material, or a laminating material for an electronic substrate.BACKGROUND ART[0002]An epoxy resin has the following characteristics: the mechanical strength, heat resistance, chemical resistance, adhesive property, and electrical insulating property are superior, and cure shrinkage is small. Therefore, the same is applied to various applications, such as a semiconductor sealing material, a laminating material for an electronic substrate, an insulating powder paint, an adhesive, and a carbon fiber composite material.[0003]In an epoxy resin applied to such applications, a curing agent is used for curing, and further a curing accelerator may be occasionally used together to progress smoothly a curing reaction and shorten a processing time. A curing accelerator functions not only to accelerate a processing speed of an epoxy resin, but also to improve various p...

Claims

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Application Information

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IPC IPC(8): C08G59/68C08G59/62
CPCC08G59/686C08G59/621C08G59/68C08G18/71C08G18/7671C08G18/833C08G18/025C08G59/50C08G59/58C08K5/0025C08K5/29C08K5/3447
Inventor TAKAHASHI, IKUOITOH, TAKAHIKONAKASHIMA, SHINICHISASAKI, TAKAHIRO
Owner NISSHINBO CHEM