Innovative air gap for antenna fan out package
a technology of air gap and antenna, which is applied in the structure of radiating elements, substantially flat resonant elements, and resonant antennas, etc., can solve the problems of difficult to reduce the size of aip devices and many challenges for aip technology
Inactive Publication Date: 2019-11-14
MEDIATEK INC
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AI Technical Summary
Benefits of technology
The patent text describes different semiconductor package structures that include a semiconductor die and a first redistribution layer (RDL) structure. These structures also include an antenna structure with different elements such as a first antenna element, a second insulating layer, and a second antenna element. The antenna structure can be formed in the first RDL structure, or in a separate layer. These semiconductor package structures can provide improved performance and reliability for wireless communication in semiconductor devices.
Problems solved by technology
Since the PCB is required to provide additional area for the antenna component to be mounted thereon, it is difficult to reduce the size of the semiconductor device.
However, AiP technology still faces many challenges, and therefore an improved antenna structure integrated into semiconductor package is desired.
Method used
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[0017]The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is determined by reference to the appended claims.
[0018]The present invention will be described with respect to particular embodiments and with reference to certain drawings, but the invention is not limited thereto and is only limited by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated for illustrative purposes and not drawn to scale. The dimensions and the relative dimensions do not correspond to actual dimensions in the practice of the invention.
[0019]FIG. 1 is a cross-sectional view of an exemplary semiconductor package structure 10 in accordance with some embodiments. In some embodiments, the semiconductor package structure...
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A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.
Description
CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of U.S. Provisional Application No. 62 / 670,922 filed on May 14, 2018, entitled “INNOVATIVE AIR GAP FOR ANTENNA FAN OUT PACKAGE,” the entirety of which is incorporated by reference herein.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a semiconductor package structure, and in particular to an antenna structure in a fan-out semiconductor package.Description of the Related Art[0003]In order to ensure the continued miniaturization and multi-functionality of electronic products and communication devices, semiconductor packages must be small in size, support multi-pin connection, operate at high speeds, and have high functionality. Additionally, in a high-frequency application such as a radio frequency (RF) system-in-package (SiP) assembly, antennas are typically used for enabling wireless communication.[0004]When wireless communication packages with antennas are const...
Claims
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Login to View More IPC IPC(8): H01Q1/22H01L23/538H01L23/66H01L23/00H01Q9/28H01Q1/38
CPCH01Q1/38H01L23/5389H01L23/66H01L2924/01029H01L2224/211H01L23/5386H01L2224/215H01L24/20H01Q9/285H01L2224/221H01Q1/2283H01L23/5384H01L23/3128H01L2223/6677H01L24/32H01L24/73H01L2224/04105H01L2224/12105H01L2224/32225H01L2224/73267H01L23/315H01Q9/0407
Inventor LIU, NAI-WEICHI, YEN-YAOKAO, YEH-CHUNYEH, SHIH-HUANGLIN, TZU-HUNGHSU, WEN-SUNG
Owner MEDIATEK INC