Manufacturing method of light-emitting device
a manufacturing method and light-emitting device technology, applied in semiconductor devices, electrical equipment, testing/measurement of semiconductor/solid-state devices, etc., can solve the problems of defective light-emitting elements, insufficient yield production, and difficulty in repair of light-emitting elements, so as to improve the yield production of light-emitting devices
Active Publication Date: 2020-06-11
AU OPTRONICS CORP
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Benefits of technology
The present invention provides a method for improving the production yield of light-emitting devices. It involves the steps of forming test traces and signal traces on a substrate, connecting a light-emitting element to the traces, performing a test procedure on the element, adding an encapsulation layer, and then removing the test traces to form a driving unit. This method allows for easy repair of any abnormal devices after the test procedure, ultimately resulting in improved yield production of the light-emitting device.
Problems solved by technology
However, in the current technology, because there is a concern that the circuit board may be damaged in the repair procedure, after a large number of light-emitting elements are transferred onto the circuit board, it is difficult to repair the light-emitting element that is defective and cannot operate normally.
Therefore, it is necessary to discard the defective device, so that the yield production is insufficient.
Method used
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[0012]The term “about,”“approximately,”“essentially” or “substantially” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by persons of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within, for example, ±30%, ±20%, ±15%, ±10%, ±5% of the stated value. Moreover, a relatively acceptable range of deviation or standard deviation may be chosen for the term “about,”“approximately,”“essentially” or “substantially” as used herein based on measurement properties, cutting properties or other properties, instead of applying one standard deviation across all the properties.
[0013]In the figures, the thicknesses of, for instance, layers, films, panels, and regions are enlarged for clarity. It should b...
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Abstract
A manufacturing method of a light-emitting device including the following steps is provided. A test trace and a first signal trace are formed on a first substrate. A light-emitting element electrically connected to the test trace and the first signal trace is formed. A test procedure is performed on the light-emitting element via the test trace and the first signal trace. An encapsulation layer is formed on the first substrate to cover the light-emitting element. The test trace is removed, and then a driving unit electrically connected to light-emitting element is formed.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 107144639, filed on Dec. 11, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.BACKGROUNDTechnical Field[0002]The present invention is related to a manufacturing method of a light-emitting device, and more particularly, to a manufacturing method of a light-emitting device having a light-emitting diode element.Description of Related Art[0003]At present, in the manufacturing process of display devices, a mass transfer technique is often used. The mass transfer technique is used to transfer a large number of light-emitting elements (e.g., light-emitting diodes) onto a circuit substrate, and then electrically connect the light-emitting elements to pixel circuits on the circuit substrate. However, in the current technology, because there is a concern that the circuit board may be da...
Claims
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IPC IPC(8): H01L33/00H01L21/66
CPCH01L2933/005H01L22/32H01L33/005H01L33/0095
Inventor CHEN, YUNG-CHIHKE, TSUNG-YINGHSU, LI-CHIHHWU, KEH-LONGWANG, WAN-TSANGLIU, CHUN-HSIN
Owner AU OPTRONICS CORP