Semiconductor package structure and method of manufacturing the same

Abstract

A semiconductor heat dissipation structure includes a first semiconductor device including a first active surface and a first back surface opposite to the first active surface, a second semiconductor device including a second active surface and a second back surface opposite to the second active surface, a first heat conductive layer embedded in the first back surface of the first semiconductor device, a second heat conductive layer embedded in the second back surface of the second semiconductor device, and a third heat conductive layer disposed adjoining the first heat conductive layer and extending to the first active surface of the first semiconductor device. The first back surface of the first semiconductor device and the second back surface of the second semiconductor device are in contact with each other. At least a portion of the first heat conductive layer are in contact with the second heat conductive layer.

Description

BACKGROUND1. Technical Field[0001]The present disclosure relates to a semiconductor package structure. In particular, the semiconductor package structure includes a semiconductor heat dissipation structure.2. Description of the Related Art[0002]Generally, a chip in a semiconductor package is encapsulated by a molding compound, and thermal energy generated from the chip may be transferred to the outside through the molding compound. The molding compound covers most of the back surface of the chip (up to 99%, or even more). Semiconductor packages have been marked by vast improvements in performance, but this has resulted in an enormous increase in thermal energy generated by the chip. The molding compound has a low coefficient of thermal expansion (CTE). Heat dissipation has thus become an issue, especially for stacked dies.SUMMARY[0003]In some embodiments, according to one aspect of the present disclosure, a semiconductor heat dissipation structure includes a first semiconductor devi...

AI Technical Summary

Benefits of technology

The patent describes a semiconductor heat dissipation structure and a semiconductor package structure including the heat dissipation structure. The technical effects of the patent include improved heat dissipation efficiency, reduced size and weight of the semiconductor package structure, and improved performance and reliability of the semiconductor device. The semiconductor heat dissipation structure includes a first semiconductor device with a first heat conductive layer and a second semiconductor device with a second heat conductive layer. The first and second devices are bonded together to form a heat dissipation structure, which is then encapsulated and connected to a heat dissipation device. This structure provides improved heat conduction and reduced contact thermal resistance, leading to improved performance and reliability of the semiconductor device.

Problems solved by technology

Semiconductor packages have been marked by vast improvements in performance, but this has resulted in an enormous increase in thermal energy generated by the chip.

Heat dissipation has thus become an issue, especially for stacked dies.

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