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Reformation of replaceable upper of offloading shoe of outsole separation structure

Inactive Publication Date: 2021-08-19
CHEN KAI CHUN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention aims to address the problem of a gap being generated at an adhered location of different materials when the modular outsole is worn for a long period time. The invention proposes a separation structure that improves this issue and allows for independent fabrication of the outsole and the adhered components using different materials. The modular outsole is mounted inside the outer cover of the modular outsole and can be adjusted to different heights based on design requirements. A replaceable upper is combined with the modular outsole via a Velcro at the periphery of the outer cover, ensuring effective fabrication speed and quantity without affecting the stability of fabricating products.

Problems solved by technology

The aforesaid patent has lowered the possibility of the gap being generated at the adhered location and has increased the stability of fabricating products, but the fabrication requires a relative precision, more time is consumed during the fabrication, and the fabricating speed and the quantity during the fabrication cannot be effectively increased.

Method used

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  • Reformation of replaceable upper of offloading shoe of outsole separation structure
  • Reformation of replaceable upper of offloading shoe of outsole separation structure
  • Reformation of replaceable upper of offloading shoe of outsole separation structure

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Embodiment Construction

[0041]Please refer to FIG. 3, a reformation of a replaceable upper of an offloading shoe of an outsole separation structure is provided by the present invention. A first step is that: a recessed container is correspondingly fabricated with respect to a modular outsole 21, the recessed container is defined as a lowest layer of the whole structure and capable of accommodating the modular outsole, and defined as an outer cover of modular outsole 23; a forming means of the outer cover can be processed by two following means: A) being directly processed through a mold fabricating means for formation; and B) fabricating an injecting mold via a three-dimensional printing means, and the outer cover of modular outsole 23 fabricated according to the two means can be tightly mounted and combined with the modular outsole 21, and a depth and a thickness defined at a periphery of the outer cover can be designed with respect to different functional requirements.

[0042]The length and the width of th...

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Abstract

The present invention is to continue the concept of a replaceable upper of offloading shoe, and further improve the processing capability. Thus this present invention is to reform the outsole separation structure of a replaceable upper of shoe.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention is aimed to continue a conventional concept of a shoe with a replaceable upper and an offloading sole of outsole 17, in which a replaceable upper 18 is adopted for being processed with an adhering application of an upper and an outsole by utilizing a means of using a male Velcro and a female Velcro; please refer to FIG. 1, an adhering process requires a Velcro at lower edge in inner layer of upper 18L and a Velcro at lateral side of outsole 21L to be combined, and the present invention provides a reformation of a replaceable upper and an outsole separation structure by utilizing a Velcro.2. Description of Related Art[0002]Please refer to FIG. 1, which discloses a conventional concept of a shoe with replaceable upper and an offloading sole of outsole provided by a prior art of a patent, the assembly of a shoe is achieved through a Velcro at lateral side of outsole 21L working with a tongue 19, a fastening...

Claims

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Application Information

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IPC IPC(8): A43B3/24A44B18/00A43B13/14A43B23/02
CPCA43B3/244A43B3/242A43B23/02A44B18/00A43B13/141A43B3/246A43B13/14
Inventor CHEN, KAI-CHUN
Owner CHEN KAI CHUN
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