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Transfer system and a fixture thereof adaptable to performing levelling alignment

a technology of transfer system and levelling fixture, which is applied in the direction of basic electric elements, electrical apparatus, and semiconductor devices, can solve the problems of damage to the pick-up head of the pick-up module, and achieve the effect of effectively transferring micro devices

Pending Publication Date: 2022-10-06
PRILIT OPTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent aims to create a system that can transfer micro devices without damaging the components of the system. The technical effect of this is to minimize the risks of damaging the micro devices during the transfer process.

Problems solved by technology

Unfortunately, during the levelling alignment stage, the levelling normal (or perpendicular) force of the pick-up module exerted on a levelling fixture may usually cause damage to the pick-up heads of the pick-up module.

Method used

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  • Transfer system and a fixture thereof adaptable to performing levelling alignment
  • Transfer system and a fixture thereof adaptable to performing levelling alignment
  • Transfer system and a fixture thereof adaptable to performing levelling alignment

Examples

Experimental program
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Effect test

first embodiment

[0022]FIG. 4A and FIG. 4B show cross-sectional views of the transfer system 100 according to the present invention. In the embodiment, a ratio of the width C1 of the cavity 131 to the width S of the pick-up head 111 is greater than 1 and is less than or equal to 1.5 (that is, 1<(C1 / S)<=1.5).

second embodiment

[0023]FIG. 5A and FIG. 5B show cross-sectional views of the transfer system 100 according to the present invention. In the embodiment, a ratio of the width C2 of the cavity 131 to the width S of the pick-up head 111 is greater than 1.5 (that is, 1.5<(C2 / S)).

third embodiment

[0024]FIG. 6A and FIG. 6B show cross-sectional views of the transfer system 100 according to the present invention. In the embodiment, the plurality of cavities 131 are interconnected to result in a single cavity to accommodate all the pick-up heads 111 of the transfer head 11.

[0025]FIG. 7 shows a cross-sectional view of a transfer system that does not adopt the levelling fixture 13 of the present invention, but uses a levelling fixture 14 having a substantially plane top surface while performing a levelling alignment stage. The levelling normal (or perpendicular) force of the transfer head 11 exerted on the levelling fixture 14 may cause damage to the pick-up heads 111 of the transfer head 11.

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Abstract

A transfer system adaptable to performing levelling alignment includes a transfer head that picks up micro devices, the transfer head having a plurality of pick-up heads protruded from a bottom surface of the transfer head; and a levelling fixture configured to perform levelling alignment for the transfer head, the levelling fixture having a plurality of cavities that are concave downwards to correspondingly accommodate the pick-up heads respectively.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention generally relates to transferring micro devices, and more particularly to a levelling fixture adaptable to performing levelling alignment.2. Description of Related Art[0002]A micro light-emitting diode (microLED, mLED or μ LED) display panel is one of flat display panels, and is composed of microscopic microLEDs each having a size of 1-100 micrometers. Compared to conventional liquid crystal display panels, the microLED display panels offer better contrast, response time and energy efficiency. Although both organic light-emitting diodes (OLEDs) and microLEDs possess good energy efficiency, the microLEDs, based on group III / V (e.g., GaN) LED technology, offer higher brightness, higher luminous efficacy and longer lifespan than the OLEDs.[0003]During manufacturing a microLED display panel, a pick-up module is used to pick up individual microLEDs, and the microLEDs are then transferred to a display panel. B...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L25/13
CPCH01L21/67144H01L25/13
Inventor WU, BIING-SENGWENG, CHUN-JENWU, CHAO-WEN
Owner PRILIT OPTRONICS INC