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Image acquisition apparatus, conversion apparatus and image acquisition method

a technology of image acquisition apparatus and conversion apparatus, which is applied in the field of image acquisition apparatus, conversion apparatus and image acquisition method, can solve the problems of large size and high cost apparatus as a whole, complicated apparatus structure, and limit the simplification of the structure of existing infrared cameras, and achieve the effect of simple structur

Inactive Publication Date: 2010-10-26
MAXELL HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]In light of the foregoing, it is desirable to provide an image acquisition apparatus of a novel type with a simple structure or a novel image acquisition method.

Problems solved by technology

Quantum well infrared cameras generally require cooling for resistance to thermal noise, which causes a large size and high cost apparatus as a whole.
On the other hand, although various types of bolometer infrared cameras have been developed with the growth of micro electro mechanical systems (MEMS) technology, the apparatus structure is complicated due to the need to place a mechanism for thermal detection in each pixel and a mechanism for signal reading from each pixel.
Therefore, there is a limit to simplification of the structure of existing infrared cameras.

Method used

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  • Image acquisition apparatus, conversion apparatus and image acquisition method
  • Image acquisition apparatus, conversion apparatus and image acquisition method
  • Image acquisition apparatus, conversion apparatus and image acquisition method

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Experimental program
Comparison scheme
Effect test

first embodiment

[0058]A first embodiment of the present invention is described hereinafter with reference to FIGS. 1 to 6.

[0059]FIG. 1 is a view to describe the schematic structure of an infrared camera 50. FIG. 2 is an explanatory view to describe the structure of a laminate on the front surface of a prism. FIG. 3 is an explanatory view schematically showing a part of a receiving surface of an image pickup device viewed from above. FIG. 4 is an explanatory view to describe the operation of an infrared camera. FIG. 5 is a graph showing the dependence of an incident angle α on a reflected light intensity. FIG. 6 is a flowchart to describe the operation of a signal processing section.

[0060]Referring to FIG. 1, an infrared camera (image acquisition apparatus) 50 includes a LED (light emitting diode) 1, a lens 2, a polarizing plate (polarizer) 3, a prism (base) 4, a metal film (thin film) 5, a laminate 6, an image pickup device 9, a lens 10, a lens 11, a filter 12, a mask (light shielding member) 13, a...

second embodiment

[0096]A second embodiment of the present invention is described hereinafter with reference to FIGS. 7 and 8. FIG. 7 is an explanatory view illustrating the structure of the laminate 6 on the front surface 4b of the prism 4. FIG. 8 is an explanatory view showing the front surface 4b of the prism 4 on which the laminate 6 is formed, viewed from the front.

[0097]In this embodiment, the infrared light absorbing layer 8 is divided into a plurality of pieces by a plurality of grooves 42, which is different from the first embodiment. It is thereby possible to further increase the clearness of a finally obtained thermal image compared with the first embodiment. The advantage described in the first embodiment is the same for this embodiment as well.

[0098]Referring to FIG. 7, the infrared light absorbing layer 8 is divided into a plurality of pieces (infrared light absorbing lands) 20 by the plurality of grooves 42. The grooves 42 extend substantially parallel to the front surface 4b of the pr...

third embodiment

[0101]A third embodiment of the present invention is described hereinafter with reference to FIGS. 9 and 10. FIG. 9 is an explanatory view illustrating the structure of the laminate 6 on the front surface 4b of the prism 4. FIG. 10 is an explanatory view showing the front surface 4b of the prism 4 on which the laminate 6 is formed, viewed from the front.

[0102]In this embodiment, the infrared light absorbing layer 8 and the dielectric layer 7 are divided into a plurality of pieces by a plurality of grooves 43, which is different from the second embodiment. It is thereby possible to further increase the clearness of a finally obtained thermal image compared with the second embodiment. The advantage described in the second embodiment is the same for this embodiment as well.

[0103]Referring to FIG. 9, the infrared light absorbing layer 8 is divided into a plurality of pieces (infrared light absorbing lands) 20 by the plurality of grooves 43. Likewise, the dielectric layer 7 is divided in...

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Abstract

An image acquisition apparatus acquires an image indicating an intensity distribution of infrared light. The image acquisition apparatus includes a conductive thin film, a dielectric layer placed on the thin film, a base to support the thin film and the dielectric layer in this order on a principal surface, a light source to emit light to an interface between the thin film and the base, and an image pickup device to receive light reflected on the interface between the thin film and the base.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an image acquisition apparatus, a conversion apparatus and an image acquisition method.[0003]2. Description of Related Art[0004]Recent developments in security-related technologies are significant for a wide range of monitoring applications such as security screening and suspicious person monitoring system. Accordingly, the demand for an infrared camera that is applicable to the monitoring purpose in addition to a simple temperature measurement purpose is rapidly growing.[0005]There are typically two kinds of infrared cameras: a quantum well infrared camera and a bolometer infrared camera. Quantum well infrared cameras generally require cooling for resistance to thermal noise, which causes a large size and high cost apparatus as a whole. On the other hand, although various types of bolometer infrared cameras have been developed with the growth of micro electro mechanical systems (MEMS) t...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G02F1/01
CPCG01J5/58G01K11/125H04N5/33G01J2005/0077G01J1/02H04N25/00
Inventor SAKEMOTO, AKITOONUKI, SATORU
Owner MAXELL HLDG LTD