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Thin-film transistor forming substrate, semiconductor device, and electric apparatus

a technology of thin film transistors and forming substrates, which is applied in the incorporation of printed electric components, electrical appliances, printed circuits, etc., can solve the problems of affecting the forming of all four sides of the fpd, adversely affecting the thickness, weight, or the like of the device, and increasing the thickness of the device, so as to prevent the increase of leakage current, increase the moisture resistance of the functional element, and increase the power consumption

Active Publication Date: 2014-08-26
E INK CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]An advantage of some aspects of the invention is that it provides a thin-film transistor forming substrate, a semiconductor device, and an electric apparatus that is thin, light and flexible and can realize a small size, a light weight, and high reliability owing to a small thickness, a small frame, and the like.
[0015]According to a first aspect of the invention, there is provided a thin-film transistor forming substrate including: a substrate that has flexibility or elasticity; and at least one electronic component that is disposed so as to be buried inside the substrate.
[0016]According to the above-described thin-film transistor forming substrate, the electronic component is buried inside the substrate having flexibility. Accordingly, even in a case where the thin-film transistor forming substrate is used in a bent state, the electronic component can be maintained well, whereby the elasticity and the robustness are superior.

Problems solved by technology

However, there are problems in that the thickness of the device is increased, and a frame area used for connections with the flexible substrates 601 is necessary.
Accordingly, as described above, this has an adverse effect on a decrease in the thickness, the weight, or the like of the device.
However, all four sides of the FPD cannot be formed to be flexible.
When such mounting is performed for the component substrate having flexibility, a connection defect occurs immediately after the connection of the flexible substrate 601 or during use, so that a defect such as the formation of a short circuit or the like frequently occurs.
Accordingly, there is a problem from the viewpoint of reliability.
In JP-A-2006-508406, although a substrate having flexibility in which an insulating polymer is used as the core is used as a metallic foil substrate, the above-described problems of the frame are not solved.
In addition, in JP-T-2004-518994 and Japanese Patent No. 3551194, although driving circuits are mounted on the surface of a component substrate, from the viewpoint of handling, there are practical problems such as the reliability of IC connection and the like.
Although ICs are connected to the uppermost surface of the substrate, a thin-film organic EL is directly formed on the driving circuits, and accordingly, the reliability of the connection of the driving circuits is not enhanced.
In addition, there is a problem from the viewpoint of robustness.
Furthermore, in Japanese Patent No. 4189887, ICs are mounted on the rear face side of a substrate in an exposed state, or the ICs are covered with a rigid thermal diffuser, whereby there is a problem of flexibility.

Method used

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Experimental program
Comparison scheme
Effect test

first embodiment

[0090]FIG. 1 is a plan view showing the configuration of a component substrate, which configures an electric apparatus, according to a first embodiment. FIG. 2 is a cross-sectional view showing a schematic configuration of an electric apparatus.

[0091]As shown in FIGS. 1 and 2, an electro-optical device (electric apparatus) 100 according to this embodiment is configured so as to include a component substrate (semiconductor device) 300 and an opposing substrate 310, which have flexibility, and an electro-optical element (functional element) 32 interposed therebetween.

[0092]The component substrate 300 is formed from a first substrate (thin-film transistor forming substrate) 30 and a driving circuit layer 24 former thereon. A first substrate 30 is mainly configured by one pair of laminated base members 30A and 30B and a plurality of electronic components 10 buried on the base member 30B side of the base member 30A. The driving circuit layer 24 is mainly configured by a control transisto...

second embodiment

[0159]FIG. 8 is a cross-sectional view showing a schematic configuration of a component substrate, which configures an electro-optical device, according to a second embodiment.

[0160]As shown in FIG. 8, the second embodiment is different from the previous embodiment in that a flexible sheet-type battery cell (electronic component) 16 as a power supply unit is buried inside the first substrate 30 (component substrate 301).

[0161]The sheet-type battery cell 16 is buried on the side of the surface 30a (a face disposed on the base member 30B side) of a base member 30A, and the plane direction of the surface of the sheet-type battery cell 16 coincides with that of the surface 30a of the base member 30A. On the rear face side of the sheet-type battery cell 16, an external connection terminal 11 is disposed. An external connection terminal 14 disposed on the rear face 30b of the base member 30A is connected to the external connection terminal 11 through a contact hole H3 that passes through ...

third embodiment

[0163]FIG. 9 is a schematic cross-sectional view showing the configuration of a component substrate, which configures an electro-optical device, according to a third embodiment.

[0164]As shown in FIG. 9, the component substrate 302 according to the third embodiment is different from that according to the previous embodiment in that an external connection electrode 14 is configured so as to be buried inside a first substrate 30.

[0165]The first substrate 30 configuring the component substrate 302 is configured by three base members 30A to 30C, and the base member 30C is disposed on the side of a face (rear face 30b) located opposite to the base member 30B side of the base member 30A. An external connection terminal 14 disposed on the rear face 30b of the base member 30A is in the state of being buried inside the base member 30C, and a state is formed in which a part thereof is exposed from a through hole 13 disposed in the base member 30C. Since a peripheral edge portion of the externa...

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PUM

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Abstract

A thin-film transistor forming substrate includes a substrate that has flexibility or elasticity and at least one electronic component that is disposed so as to be buried inside the substrate. The electronic component is configured so as to include one or more types of an IC, a capacitor, a resistor, and an inductor.

Description

BACKGROUND[0001]1. Technical Field[0002]The present invention relates to a thin-film transistor forming substrate, a semiconductor device, and an electric apparatus.[0003]2. Related Art[0004]Recently, a general configuration of a flat panel display (FPD) such as a liquid crystal device, an organic EL display device, or an electrophoretic display device is disclosed in JP-A-2007-249231 and Japanese Patent No. 4366743. In the general configuration, an active matrix of TFTs is formed on a component substrate formed from a rigid glass substrate, and a flexible substrate (hereinafter, also referred to as an FPC) in which driving circuits are mounted is connected to the component substrate.[0005]In a structure illustrated in FIG. 37A, three flexible substrates 601 in which a scanning line driving circuit 61, a data line driving circuit 62, and a common power source circuit 64 are mounted are connected to three sides of a component substrate 600, and it is common to use the flexible substr...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K1/00
Inventor SATO, TAKASHI
Owner E INK CORPORATION