Non-contaminating pressure transducer module

Abstract

A non-contaminating pressure transducer module having an isolation member is disclosed. The isolation member isolates a pressure sensor within the transducer module from exposure to ultra high purity fluids flowing through a conduit in the module without significantly affecting the accuracy of the pressure measurement. The transducer module may be positioned within a fluid flow circuit carrying corrosive materials, wherein the pressure transducer module produces a control signal proportional to either a gauge pressure or an absolute pressure of the fluid flow circuit. The pressure transducer module of the present invention also avoids the introduction of particulate, unwanted ions, or vapors into the flow circuit.

Description

BACKGROUND OF THE INVENTIONI. Field of the InventionThis invention relates generally to non-contaminating pressure transducer modules, and more particularly relates to a pressure transducer module that effectively operates within Ultra High Purity (UHP) processing equipment that utilize UHP chemicals and require UHP conditions. The pressure transducer module of the present invention provides a continuous measurement of the pressure within a fluid flow circuit of the UHP processing equipment without contaminating the fluid within the circuit. An isolation member .[.which.]. isolates a pressure sensor from the chemically corrosive fluid flow. The pressure sensor adjoins the isolation member without compromising the accuracy of the pressure measurement or increasing the risk of fluid contamination. The isolation member may be interchangeable and eliminates the need to submerge the pressure sensor in an oil or other fluid, thereby eliminating potential contaminants to the fluid flow cha...

AI Technical Summary

Benefits of technology

The purpose of the present invention is to provide a pressure transducer module that effectively operates within a fluid flow circuit of UHP processing equipment over a wide range of temperatures with minimal affects on the accuracy and resolution of the

Problems solved by technology

During the processing of semiconductor substrates, the substrate is commonly subjected to chemically corrosive fluids and high temperatures.

A highly corrosive environment may be created when aggressive processing chemicals are delivered to the processing equipment.

Of course, anything mechanical is subject to potential leakage and such leakage can create extremely hazardous conditions both to the processing of semiconductor wafers or other products and also to personnel who may have to tend and maintain the processing equipment.

First, a change in pressure within the system may indicate leakage within the system.

When highly corrosive hazardous chemicals are used, such corrosive atmospheric environments are extremely hard on the monitoring and sensing equipment.

Further, the monitoring and sensing equipment may transmit wafer damaging particulate, ions, or vapors as a result of exposure to the corrosive atmospheric environment.

Metals, which are conventionally used in such monitoring devices, cannot reliably stand up to the corrosive environment for long periods of time.

Significantly, a mere substitution of materials in the monitoring device oftentimes produces a device with other deficiencies, including leaks and inoperativeness.

Although pressure sensors have generally been developed for use in other applications, these sensors are not particularly well suited for use in semiconductor substrate UHP processing equipment.

When subjected to chemically corrosive fluids used in semiconductor substrate processing equipment, the processing fluids permeate through the coating of the protective member, corrode the metal and permeate back through the coating thereby contaminating the processing fluids.

This contamination is not acceptable in UHP processing equipment.

Further, it is believed that the stiffness of the metal coated '

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