8results about How to "Avoid softening and deformation" patented technology

The invention relates to a central structure of a high-capacity vertical kiln, which is arranged at the center of the vertical kiln; the structure comprises a central cylinder, an upper support assembly, a distributor and an annular discharging device; the central cylinder is composed of a main steel pipe, a cooling air duct, a swirl sheet and a refractory protective layer; the main steel pipe, the cooling air duct, the distributor and the annular discharging device are all coaxially arranged with the vertical kiln; the cooling air duct is arranged inside the main steel pipe, and a swirl sheet is arranged in the annular space between the cooling air duct and the main steel pipe; the invention arranges a central cylinder in the kiln chamber, so that the heating of the material in the kiln is more uniform; the central cylinder is cooled by cooling wind, a refractory protective layer is arranged on the outer side of the central cylinder, the upper end is supported by an upper support assembly, and a matching distributor is arranged, which can effectively prevent the impact of the material entering the kiln and the erosion of the high temperature in the kiln, and the overall structure is more stable.

The present invention relates to a sintering method for dental glass ceramics, in particular to a sintering method for glass ceramic blanks with different sizing ratios. The method solves the deformation problem of glass ceramics with different sizing ratios during the final sintering process, so that the edge tightness of the product after sintering meets the requirements.

The invention provides a continuous forming and gradient flooding method and device for a spherical energetic material. The method comprises the following steps: forming liquid medicine into uniform micro-drops through a micro-channel device, and sequentially feeding the uniform micro-drops into three stirring kettles which are connected in series: curing and forming in a first stirring kettle at 5-25 DEG C, overflowing into a second stirring kettle, carrying out low-temperature flooding at 40-60 DEG C so as to remove more than 80% of solvent, overflowing into a third stirring kettle, and completing high-temperature deep flooding at 70-90 DEG C, and finally cooling to room temperature through a cooling device. And the three stirring kettles realize continuous transfer through an overflow structure, and manual intervention is not needed. The device comprises a metering pump, a micro-channel device, three stirring kettles connected in series and a cooling device. Through the gradient strategy of low-temperature pre-desolvation and high-temperature deep desolvation, the contradiction between particle softening deformation and solvent residue in the traditional process is solved, the particle size distribution deviation of the spherical energetic material is smaller than or equal to 5%, the deformation rate is smaller than or equal to 2%, the solvent residue is smaller than or equal to 50 ppm, the production continuity is improved by 40% or above, and the method is particularly suitable for continuous production of temperature-sensitive energetic drugs.

The present invention discloses a method for transferring an organic semiconductor array based on a flexible substrate. According to a preset array form, a silicon wafer including a silicon column array is prepared; the silicon column is surface treated to make the top of the surface of the silicon column hydrophilic and the side wall hydrophobic; the top surface of the silicon column after the surface treatment is covered with an organic semiconductor solution; the surface of the intermediate substrate coated with a metal film is bonded to the top surface covered with the organic semiconductor solution and then treated to make the organic semiconductor solution self-assemble on the surface of the metal film to form a semiconductor array on the surface of the metal film; then, the semiconductor array is transferred to the flexible substrate. This method uses the metal film on the intermediate substrate as an intermediate medium to solve the problem that the flexible substrate is not resistant to high temperature and cannot be directly used as a substrate to prepare an organic micro-nano array, thereby providing a new method for preparing an organic semiconductor array.

The utility model relates to a kind of heat output device and clothes dryer, belong to clothes dryer field, and heat output device includes: support assembly, the support assembly is equipped with first accommodating space and air outlet, the air outlet with the first accommodating space intercommunication;Heating assembly, the heating assembly is set on the support assembly and is located at the first accommodating space;Fan module, the fan module is set on the support assembly, the fan module is used to generate negative pressure airflow and transport the heat generated by the heating assembly towards the air outlet;Thermal insulation shell, the thermal insulation shell is set on the support assembly, the thermal insulation shell extends along height direction, and the thermal insulation shell is used to cooperate with the shell of clothes dryer.This application discloses heat output device by thermal insulation shell along height direction extension and cooperate with the shell of clothes dryer, can effectively reduce the area of clothes dryer shell exposed in hot air, to reduce the risk that shell is softened because of high temperature.

The cooking utensil comprises a shell, a frying basket, a baking tray assembly and a fan assembly, a cooking cavity and an assembly cavity which are communicated are formed in the shell, a vent hole communicated with the assembly cavity and an opening communicated with the cooking cavity are formed in the shell, the frying basket penetrates through the opening to be arranged in the cooking cavity, and the baking tray assembly is arranged at the top of the shell; the fan assembly is arranged in the assembly cavity, and the fan assembly is used for forming airflow flowing from the assembly cavity to the vent hole and airflow flowing from the assembly cavity to the cooking cavity; a first channel, a second channel and a third channel which are respectively communicated with the assembly cavity are further arranged in the shell, the first channel is arranged between the side wall of the cooking cavity and the side wall of the shell, the second channel is arranged at the bottom of the cooking cavity, and the third channel is arranged at the top of the cooking cavity; the shell is provided with a first air inlet hole, a second air inlet hole and a third air inlet hole which communicate with the first channel, the second channel and the third channel correspondingly. The cooking utensil has a good heat dissipation effect and is long in service life.

The utility model relates to the technical field of die processing, in particular to a cutting device for die processing, which comprises a base and a frame fixed on the right side of the upper end of the base. A cutting table is fixed to the upper end of the machine base, an annular cover is arranged above the cutting table, a fixing shaft is fixed to the top end in the annular cover, an electric cutter composed of a motor and a cutting disc is fixed to the lower end of the fixing shaft, an annular pipe is arranged on the periphery of the electric cutter in a sleeving mode, and the two sides of the lower end of the annular pipe communicate with cooling sprayers correspondingly; a water storage tank is fixed to the top end in the rack. A water conveying assembly is arranged between the water storage tank and the water conveying pipe. The cooling device is favorable for uniformly and comprehensively cooling the cutting part of the mold and the cutting disc of the electric cutter, and effectively prevents the cutting part of the mold from softening and deforming due to high temperature, so that the cutting quality of the mold is ensured, wastewater is favorably recycled, and water resources are saved.

The utility model discloses quick butt welding equipment for PVC (polyvinyl chloride) pipes, which comprises a base, a heating module, a clamping mechanism and a control system, guide rollers with V-shaped grooves are arranged at two ends of the base, and the quick butt welding equipment can adapt to axial positioning of different pipe diameters; the heating module is of a vertically symmetrical heating block structure, the inner surface of the heating module is covered with an elastic heat conduction pad, independent temperature control heating units are evenly distributed in the circumferential direction of the interior of the heating module, and accurate pressure control is achieved through a driving air cylinder. The clamping mechanism is provided with a bidirectional lead screw to drive a synchronously adjusted fixing clamp and is combined with a laser centering sensor to realize automatic alignment of the end face of the pipeline; the control system integrates temperature, pressure and photoelectric sensing modules and monitors welding parameters in real time. The equipment has the characteristics of rapid remodeling and multi-specification compatibility, the welding quality is improved through partition temperature control and a flexible heat conduction structure, and the problems that traditional PVC pipe welding is low in efficiency and large in alignment deviation are effectively solved.