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Semiconductor component comprising surface metallization

A technology of semiconductors and devices, which is applied in the field of semiconductor devices, can solve problems such as easy breakage of welding joints, and achieve the effect of reducing danger and simplifying the structure of printed circuits

Inactive Publication Date: 2007-09-26
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Its disadvantage is that, in devices of the above-mentioned type, the solder joints in the soldered state are prone to fracture when said device is subjected to temperature-varying loads

Method used

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  • Semiconductor component comprising surface metallization
  • Semiconductor component comprising surface metallization
  • Semiconductor component comprising surface metallization

Examples

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Embodiment Construction

[0025] Figure 1b shows a cross-sectional view of a semiconductor device fabricated with MID technology. In MID technology or CIMID technology, a base body 2 with a recess in which the semiconductor body 3 is arranged is used as the housing. On the housing base 2 , printed circuit structures 7 are formed by means of a surface metallization, which form the chip connection region 4 and the wire connection region 5 for contacting the semiconductor body 3 in the recess. The electrical connection between the semiconductor body 3 and the printed circuit structure 7 can be produced, for example, via a wire connection 6 .

[0026] On the outside of the housing, the solder joint 1 is formed by a printed circuit structure 7 . The electrical connection between the chip connection area 4 or the wire connection area 5 and the solder joint 1 is likewise implemented via a printed circuit 7 running on the surface of the housing base body 2 .

[0027] FIG. 1 a shows a top view of the side of ...

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PUM

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Abstract

The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body ( 3 ) and a package base body ( 2 ) on whose surface conductor path structures ( 7 ) are formed by means of surface metallization. A subregion of the conductor path structure ( 7 ) constitutes the solder connections of the semiconductor component. The solder connections ( 1 ) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.

Description

technical field [0001] The invention relates to a semiconductor component having at least one semiconductor body and a housing base body, the housing base having a support surface for mounting the semiconductor component, on which a plurality of solder joints are formed by means of a surface metallization , wherein the welding heads are combined into a plurality of welding head columns. Background technique [0002] A semiconductor component with a surface metallization is disclosed, for example, in US Pat. No. 5,081,520. Therein, a semiconductor component with a semiconductor body and a substrate is shown, which has a surface metallization in the form of a printed circuit structure on its main surface. The semiconductor body is contacted via a subregion of the printed circuit structure. A further subarea of ​​the printed wiring structure is used as a wiring area of ​​the device. [0003] Such a connection plane implemented as a surface metallization is also used in so-ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/057H01L23/13H01L23/498H01L23/12H01L23/04H01L23/08H05K1/02H05K3/34
CPCH05K2201/09381H01L2224/73265H05K2201/09181H01L2224/32225H01L2924/12041H05K2201/10727H01L2224/48091H05K1/0271H01L2224/48227H05K2201/09472H01L24/48H05K3/3442H01L23/49805H01L24/73H01L2224/05599H01L2224/48237H01L2224/48464H01L2224/854H01L2924/00014H01L2924/12043H01L2924/181Y02P70/50H01L2924/00012H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
Inventor H·布伦纳T·赫菲H·耶格尔
Owner OSRAM OPTO SEMICON GMBH & CO OHG
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