Semiconductor apparatus and processing system utilizing the same semiconductor apparatus

A semiconductor and conversion device technology, applied in semiconductor devices, record carriers used in machines, semiconductor/solid-state device components, etc., can solve the problems of rising cost, complex chip structure, waste of performance, etc., and achieve the effect of increasing the scale of the circuit

Inactive Publication Date: 2007-10-10
RICOH KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] If the known tolerance technology is applied to the semiconductor device chip used by the above-mentioned read / write device driven by a 3.3V level signal, a 5V level signal can be input, but the chip output signal level is raised from 3.3V to 5V will cause complex chip structure and large chip size, resulting in increased cost
In addition, the low-power-consumption chip manufactured with 0.35μm process regulations and driven by a low voltage of 3.3V will be used as a chip driven by 5V, which will waste more performance

Method used

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  • Semiconductor apparatus and processing system utilizing the same semiconductor apparatus
  • Semiconductor apparatus and processing system utilizing the same semiconductor apparatus
  • Semiconductor apparatus and processing system utilizing the same semiconductor apparatus

Examples

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Embodiment Construction

[0026] Next, as an example of a system for processing signals of different levels, a system composed of an advanced magnetic card and a read / write device for the advanced magnetic card will be described, and a system including a semiconductor device according to an embodiment of the present invention will be described in detail.

[0027] Fig. 1 shows the state that advanced magnetic card 200 is connected with advanced magnetic card read / write device 150, data is written in advanced magnetic card 200, or from the occasion of reading data from advanced magnetic card 200, as the semiconductor device related to the embodiment of the present invention The read / write controller 100 sends a turn-on control signal to the power switch 110, thus supplying 5V power to the advanced magnetic card 200 and IC2 (refer to FIG. 2 , which will be described in detail later) built in the controller 100. Thereafter, the read / write controller 100 transmits the clock signal CLK to the advanced magneti...

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Abstract

A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first bonding pads outputting first signals having a first level. The second semiconductor chip includes a plurality of second bonding pads and a plurality of third bonding pads. The plurality of second bonding pads is electrically coupled to a part of the plurality of first bonding pads to receive the first signals having the first level from the first semiconductor chip through the part of the plurality of first bonding pads. The plurality of third bonding pads converts the first signals received through the plurality of second bonding pad into second signals having a second level different from the first level and outputs the second signals through the plurality of third bonding pads.

Description

technical field [0001] The present invention relates to a semiconductor device corresponding to input and output of signals of different levels, and a processing system of signals of different levels using the semiconductor device. Background technique [0002] The input / output signal level of a chip included in a semiconductor device becomes lower as the design rule of the chip becomes smaller. For example, in the case of manufacturing chips with a process specification of 0.5 μm or more, the input and output signal levels are mostly above 5V, while in the case of manufacturing chips with a process specification of 0.35 μm or less, the input and output signal levels are set below 3.3V. Among chips manufactured with a 0.35 μm process specification, there are also chips that can operate normally not only for 3.3V level signals but also for input 5V level signals by using well-known tolerance techniques. [0003] Next, as an example of a system that handles different signal l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00G06K19/00G06K19/07G06K7/00G11C7/00G06K17/00H01L23/50H01L25/04H01L25/065H01L25/18
CPCH01L25/0655H01L23/50H01L2924/01083H01L2924/01005H01L2924/01082H01L2224/48137H01L2924/01015H01L2224/49171H01L2224/49175H01L2924/01023H01L24/49H01L2224/48247H01L2924/01004H01L2924/19043H01L2924/01006H01L2924/01033H01L24/48H01L2924/13091H01L2924/00014H01L2924/181H01L2224/05554H01L2924/10161H01L2924/10162H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012
Inventor 山本齐
Owner RICOH KK
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