Semiconductor apparatus and processing system utilizing the same semiconductor apparatus

Abstract

A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first bonding pads outputting first signals having a first level. The second semiconductor chip includes a plurality of second bonding pads and a plurality of third bonding pads. The plurality of second bonding pads is electrically coupled to a part of the plurality of first bonding pads to receive the first signals having the first level from the first semiconductor chip through the part of the plurality of first bonding pads. The plurality of third bonding pads converts the first signals received through the plurality of second bonding pad into second signals having a second level different from the first level and outputs the second signals through the plurality of third bonding pads.

Description

technical field [0001] The present invention relates to a semiconductor device corresponding to input and output of signals of different levels, and a processing system of signals of different levels using the semiconductor device. Background technique [0002] The input / output signal level of a chip included in a semiconductor device becomes lower as the design rule of the chip becomes smaller. For example, in the case of manufacturing chips with a process specification of 0.5 μm or more, the input and output signal levels are mostly above 5V, while in the case of manufacturing chips with a process specification of 0.35 μm or less, the input and output signal levels are set below 3.3V. Among chips manufactured with a 0.35 μm process specification, there are also chips that can operate normally not only for 3.3V level signals but also for input 5V level signals by using well-known tolerance techniques. [0003] Next, as an example of a system that handles different signal l...

AI Technical Summary

Problems solved by technology

[0005] If the known tolerance technology is applied to the semiconductor device chip used by the above-mentioned read / write device driven by a 3.3V level signal, a 5V level signal can be input, but the chip output signal level is raised from 3.3V to 5V will cause complex chip structure and large chip size, resulting in increased cost

In addition, the low-power-consumption chip manufactured with 0.35μm process regulations and driven by a low voltage of 3.3V will be used as a chip driven by 5V, which will waste more performance

Images