Composite leadframe LED package and method of making the same
A lead frame and lead technology used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as affecting reliability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0018] Reference will now be made to Figures 1 through 1 which illustrate different embodiments of the invention. image 3 The invention is described. As illustrated in the figures, the size of layers or regions are exaggerated for illustrative purposes and thus are provided to illustrate the general structure of the invention. Furthermore, various aspects of the invention are described with reference to structures or portions formed on other structures, portions, or both. It will be apparent to those skilled in the art that reference to a structure formed "on" or "over" another structure or portion encompasses intervenable additional structures, portions, or both. References to a structure formed "on" another structure or portion without an intervening structure or portion are described herein as being formed "directly" on said structure or portion. In addition, relative terms such as "on" or "above" are used herein to describe the relationship of one structure or part to a...
PUM
![No PUM](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap