Wafer grinding device and method

Abstract

The invention is to prevent a wafer and a detection terminal for thickness measurement from being damaged caused by abrasive grains fallen off from a grinding wheel when grinding is made while measuring the thickness of a workpiece by bringing the detection terminal for thickness measurement into contact with the workpiece. When the wafer W held to a chuck table 2 is ground by using the grinding wheel 33 and the thickness of the wafer W is measured by bringing the detection terminal 50 into contact with the grinding face of the wafer W, washing water 53 is supplied to the contact part 50a of the detection terminal 50 with the wafer W, and the abrasive grains 33a fallen off from the grinding wheel 33 are removed from the contact part 50a.

Description

technical field [0001] The present invention relates to a grinding device and a grinding method for grinding the surface of a plate-shaped object such as a semiconductor wafer, and particularly relates to a grinding device having a function of measuring the thickness of the object to be ground and a grinding method using the same. Background technique [0002] In order to smooth the surface of various plates and achieve the desired thickness, they must be ground with grinding wheels. For example: a semiconductor wafer, the desired thickness is formed by grinding the backside where no circuit is formed. [0003] When grinding the backside of semiconductor wafers, such as Figure 5 As shown, the semiconductor wafer W is held on the chuck table 80 with the back surface W1 exposed. Moreover, the semiconductor wafer W also rotates along with the rotation of the chuck table 80, and at the same time, the grinding mechanism 82 having the grinding wheel 81 descends while rotating, a...

AI Technical Summary

Problems solved by technology

In addition, there is also a problem that the detection terminal is scratched by the fallen abrasive grains, and the measurement accuracy of the thickness is reduced.

[0008] Also, the adhesive will come off the grinding wheel

In this case, since the hardness of the adhesive itself is much lower than that of the wafer, the adhesive is mixed between the detection terminal and the wafer, and the possibility of scratching the wafer is low.

However, once it is mixed between the detection terminal and the wafer, the detection terminal will rise by a corresponding amount, which will cause errors in wafer thickness measurement.

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