Process for manufacturing chip resisor in low value of resistance and structure
A technology of chip resistors and low resistance value, applied in the direction of resistors, non-adjustable metal resistors, circuits, etc., can solve the problems of industrial utilization restrictions, impedance accuracy variation, impedance changes, etc., and achieve mass production using process, impedance The effect of precision improvement and effective process
Inactive Publication Date: 2008-08-13
PROSPERITY DIELECTRICS
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Problems solved by technology
[0007] However, when using the above-mentioned known technology, since the resistance adjustment and trimming groove is formed on the appropriate section of the resistance layer and the first insulation protection layer by laser beam focusing, after the resistance layer and the first insulation protection layer are completed, A resistance adjustment trimming groove is formed at the place, so it is necessary to choose a laser light with higher power, which will cause restrictions on industrial use
Furthermore, the formed resistance adjustment trimming groove is in the resistance layer and the first insulating protection layer, so it is more likely to have the problem of variation in impedance accuracy after trimming, and when the chip resistor is used in practice, it is easier There is a situation where the resistance changes due to heat
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[0038] The specific method and control flow adopted by the present invention will be further described with the following embodiments and accompanying drawings.
[0039] refer to figure 2 As shown, it is a cross-sectional view showing the structure of the chip resistor completed according to the manufacturing process of the present invention. It shows that the chip resistor completed by the manufacturing process of the present invention mainly includes a substrate 1, and the substrate 1 can be made of alumina material. A pair of back conductive layers 21 , 22 are printed on the back surface of the substrate 1 , and a pair of surface conductive layers 31 , 32 are printed on the upper surface of the substrate 1 .
[0040] A resistance layer 4 is printed and formed on the surface of the substrate 1 between the surface conductive layers 31 , 32 , and both ends of the resistance layer 4 are electrically connected to the surface conductive layers 31 , 32 . A resistance adjustment...
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The resistor includes a base plate, a pair of conductive layer, and a resistance layer, a trimming slot for adjusting resistance and an insulation protection layer formed on the resistance layer and the trimming slot. The procedure for producing the resistor includes steps: forming and burning the pair of conductive layer on the base plate; burning the resistance layer on surface of the base plate between conductive layers so as to form the trimming slot in use for adjusting impedance of the resistor; finally, forming the insulation protection layer on the resistance layer and the trimming slot. Features are: lowered trimming power of layer needed, lowered variety of impedance caused by heat, effective procedure for production in large scale, and lowered variance of impedance precision.
Description
technical field [0001] The invention relates to a manufacturing process and structure of a chip resistor, in particular to a manufacturing process and structure of a low-resistance chip resistor. Background technique [0002] Chip resistors have been widely used in various electronic equipment, instrument equipment and communication equipment. Chip resistors are roughly divided into two types: thick film chip resistors and thin film chip resistors. The electrodes and resistance layers of the thick film chip resistors are produced by printing or firing techniques. The electrodes and resistive layers of thin film chip resistors are made by sputtering technology. [0003] In a typical chip resistor manufacturing process (see figure 1 As shown), it is mainly to provide a pair of back conductive layers 21, 22 on the lower surface of a substrate 1, and form a pair of surface conductive layers 31, 32 on the upper surface of the substrate 1. After the back conductive layers 21, 2...
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IPC IPC(8): H01C7/00
Inventor 周东毅甄文均蔡燕山
Owner PROSPERITY DIELECTRICS