Structure of package using coupling and its forming method

Abstract

The invention relates to a structure for using projection to seal and it's forming method. It first forms a barrier and an adhesion coating layer on a base material with a pad and a protecting layer, and then it forms a first projection and a second projection on the flat region of the first projection and at lest connects the external electrode of the chip on the second projection.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a flip-chip packaging structure. Background technique [0002] A light-emitting diode is a light-emitting component that can directly convert electrical energy into visible light. It has the characteristics of low operating voltage, low power consumption, and high luminous efficiency. The core light-emitting part of the light-emitting diode is composed of P-type and N-type semiconductors. When the minority carrier injected into the PN junction recombines with the majority carrier, it will emit visible light, ultraviolet light or near-infrared light. [0003] For GaN series high-brightness light-emitting diodes using sapphire substrates, since the PN electrodes are located below, flip-chip packaging can provide 1.5 to 1.7 times the luminous efficiency compared with wire-bonding packaging due to the non-shielding characteristics. Moreover, the heat energy generated by the light...

AI Technical Summary

Problems solved by technology

[0006] When the two bumps are joined, the uneven contact surface can easily lead to poor joint quality, resulting in short circuit or open circuit of the contact

And this uneven surface, when bonding the substrate and the chip, is easy to cause the crack of the chip, reducing the product yield, and the larger the chip to be bonded, the more uneven the joint surface will be. tricky

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