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L type bracket encapsulation for coaxial parts of semiconductor laser

A technology of lasers and semiconductors, applied in semiconductor lasers, structural details of semiconductor lasers, laser components, etc., can solve problems affecting device yield, large aberration coupling efficiency, cost increase, etc., and achieve fast, simple, reliable and efficient coupling packaging , reduce production costs, and simplify the coupling process

Inactive Publication Date: 2008-09-24
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this process, due to the large aberration of the general lens, the coupling efficiency is difficult to be satisfactory, and the cost of using a special lens is greatly increased, and more importantly, the power loss is difficult due to the fact that the cap is not in the center or the stress caused by the welding process Modifications that directly affect device yield

Method used

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  • L type bracket encapsulation for coaxial parts of semiconductor laser
  • L type bracket encapsulation for coaxial parts of semiconductor laser
  • L type bracket encapsulation for coaxial parts of semiconductor laser

Examples

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Embodiment Construction

[0014] see figure 1 ,exist figure 1 In the embodiment of the present invention, the L bracket 10 requires a sufficiently large fixing area and a relatively strong supporting force, and at the same time, cannot be in contact with the pins 14 of the tube base and the tube shell 7 . Using wire cutting and finishing technology to make the bottom surface 25 of the L bracket 10 a U-shaped plane, that is, crossing the pin 14 and increasing the fixed contact area with the tube base 1 through the circular arc design, the two sides of the U shape are formed by the outer surface 23. A triangular cylinder formed by the inner side 24 and the bottom 25. This triangular structure is relatively stable. The outer side 23 is an inclined plane for laser welding, and the inner side 24 is perpendicular to the bottom. The fixed platform 21 is a trapezoidal prism with a large upper surface and a small lower surface, and the two sides 22 are processed into inclined surfaces, so that the inclined sur...

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Abstract

Using L type bracket, coaxial packaging device caries out fixture joint between semiconductor laser and optical fiber. Packaging device in the L type bracket includes parts: tube sheet of rounded body case; tube support is fixed on one end of tube sheet; L type bracket is fixed on one face of the tube support inside the tube sheet; silicon heat sink with semiconductor laser is fixed on tube sheet; backlight detector is fixed on a face of the tube support inside the tube sheet; pins of the tube support are inserted to the support; interconnection gold wire connects semiconductor laser, backlight detector, and pins of the tube support.

Description

technical field [0001] The invention belongs to the technical field of optical fiber communication, and more specifically relates to a coaxial packaging device for fixedly connecting a semiconductor laser and an optical fiber by using an L-shaped bracket. Background technique [0002] In optical fiber communication technology, semiconductor lasers are widely used as signal sources. Since it is necessary to couple the laser emitted by the semiconductor laser into the optical fiber before it can be used in the optical fiber communication system, there are many different types of coupling packaging devices, such as coaxial packaging, dual in-line packaging and butterfly packaging. Due to the characteristics of small size, low cost and changeable styles, devices in the form of coaxial packaging are widely used in access networks, metropolitan area networks, rack switching, and cable television. Usually, the semiconductor laser coaxial device, due to the small area of ​​the tube...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022H01S5/026H01S5/02
Inventor 王欣袁海庆祝宁华
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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