Adaptive coupled semiconductor laser butterfly sealing devices

Abstract

The present invention is an adaptive coupling semiconductor laser butterfly packaging device, the device comprises: a butterfly shell; a semiconductor refrigerator is welded in the butterfly shell; a semiconductor laser, an optical fiber, a backlight detector and a microwave The silicon heat sink of the microstrip circuit is fixed on the semiconductor refrigerator; the shell pins are fixed on both sides of the butterfly shell; the microwave microstrip circuit and the shell pins on the silicon heat sink are connected by interconnecting gold wires. The device can quickly and easily perform the coupling work between the semiconductor laser and the optical fiber, has high coupling speed, high production efficiency, low production cost and good temperature stability.

Description

Technical field [0001] The invention belongs to the technical field of optical fiber communication, more specifically, it belongs to a butterfly package coupling device of a semiconductor laser and an optical fiber. Background technique [0002] In optical fiber communication technology, a semiconductor laser is usually used as a signal source for optical fiber communication. In order to guide the laser generated by the semiconductor laser into the optical fiber, the semiconductor laser needs to be coupled and packaged into a specific packaging form to achieve stable and reliable coupling of the optical signal generated by the semiconductor laser into the optical fiber, as well as DC bias and modulation The purpose of introducing electrical signals such as signals into semiconductor lasers. Common coupling packaging forms include coaxial packaging, butterfly packaging, dual in-line packaging, small dual in-line packaging, and so on. Because of the large internal space of the butt...

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Problems solved by technology

In the common semiconductor laser butterfly packaging device, the optical fiber is usually fixed on the pedestal of the butterfly shell or in the tail pipe attached to the shell by laser welding or gluing. This coupling method has difficulties in coupling and alignment. It is necessary to precisely adjust the optical fiber to the light-emitting position of the semiconductor laser, resulting in low production efficiency, high requirements for skilled workers, and high production costs; and during the working process of the semiconductor laser butterfly packaging device, due to the heating of the semiconductor laser itself, The heat migration effect of the semiconductor refrigerator, the temperature change of the surrounding environment and other reasons will cause a certain temperature gradient between the position of the semiconductor laser and the position of the fixed optical fiber, so that the thermal expansion and contraction of the material are not consistent, which will eventually lead to the position of the semiconductor laser. The position relative to the optical fiber changes, which affects the light output stability of the device. In severe cases, there may even be no light output at all.

For the semiconductor laser coupling that uses the alignment mark of the heat sink to align the optical waveguide of the semiconductor laser, it is still necessary to accurately align the position of the semiconductor laser with the alignment mark. This process takes a long time and there are certain problems. Difficult, and the process also needs to use relatively expensive undercut welding equipment, and the production cost is also high

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