Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor manufacture equipment control system and method

A control system and semiconductor technology, applied in the field of communication, can solve problems such as uncontrollable process reaction modules, status information cannot be deeply understood, and affect production efficiency, so as to simplify the overall control link, avoid information islands, and reduce efficiency wasteful effect

Active Publication Date: 2008-10-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process requires multiple information interactions and verification processes between the factory system and equipment. The semiconductor processing process becomes more and more complex, and the material transfer becomes more and more frequent, which will greatly affect the efficiency of production.
[0007] Secondly, from the perspective of the factory's manufacturing process management, the factory's manufacturing execution system is only responsible for issuing process tasks to each device, and the specific task identification and execution are completed by the overall machine control module in coordination with the transmission and process response modules under its jurisdiction. The manufacturing execution system of the factory cannot control the process reaction module of each equipment, and cannot deeply understand the status of the machine, especially the status information of the process reaction module
As a result, it is impossible to coordinate manufacturing resources uniformly within the entire factory
[0008] Finally, from the perspective of factory automation, according to such an equipment control system, several major components of the factory automation system: material management system, manufacturing execution system and advanced process control system cannot be integrated
The above-mentioned three major systems are separate. Although the SEMI standard has formulated corresponding interface standards in the three fields, the "information island" in the factory formed by such separate systems will definitely hinder the improvement of the production efficiency of the semiconductor manufacturing factory.
On the other hand, semiconductor equipment manufacturers must also customize corresponding software / hardware for the three major systems, which increases the complexity and maintenance difficulty of semiconductor equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor manufacture equipment control system and method
  • Semiconductor manufacture equipment control system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following describes the communication method of the etching equipment subsystem of the present invention and the specific implementation of the device in further detail in conjunction with the accompanying drawings, but it is not used to limit the scope of protection of the present invention.

[0021] A semiconductor process equipment control system, with the equipment module controller (EMC) and the engineering equipment module controller (EMC) as the unified controller of the factory, responsible for centralized management of material in and out and scheduling transmission between different reaction modules of the equipment, It also executes the process processing tasks from the factory manufacturing execution system; at the same time, it directly controls the transmission of materials according to the preset optimization algorithm and parameter values ​​such as time and sequence logic; provides a consistent interface to the factory material management and manufactu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a semiconductor technology equipment control system, referring to communication field. Said control system consists of technology processing module controller (PMC) and relevant interface module, equipment module controller (EMC) and plant engineering data base (EEDB), wherein EMC used as integrating control unit connected with PMC, EEDB and interface module for total scheduling and controlling; EEDB connected with EMC and PMC for collecting and storing information from EMC and PMC and providing relevant parameter. The present invention can integrate three large systems at equipment terminal, greatly simplifying software and hardware configuring for semiconductor equipment manufacturer.

Description

technical field [0001] The invention relates to the communication field, in particular to a control system and a method thereof in semiconductor etching equipment. Background technique [0002] Modern large-scale integrated circuit manufacturing requires the use of dozens of process equipment for hundreds of processes. The equipment in an integrated circuit manufacturing plant is usually divided into several areas such as deposition, lithography, etching, and diffusion. Each The areas are all composed of semiconductor equipment processed by the same or similar process. The factory material transfer / management system (MHS) transfers materials between different regions, and the entire silicon wafer production process is coordinated by the factory-level Manufacturing Execution System (MES) to uniformly manage materials between different machines in different regions Coordination among them, and then complete the entire complex semiconductor process. With the continuous reduct...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00G05B15/02G05B19/418
CPCY02P90/02
Inventor 史亚巍
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products