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Device for extracting electronic components

A technology of electronic components and components, applied in the direction of electrical components, electrical components, circuits, etc., can solve the problems of difficulty in integrating the take-out device into the processing line, occupying land, etc.

Inactive Publication Date: 2008-11-05
ISMECA SEMICONDUCTOR HOLDING SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The integration of prior art take-out devices into processing lines is generally difficult because they take up space

Method used

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  • Device for extracting electronic components
  • Device for extracting electronic components
  • Device for extracting electronic components

Examples

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Embodiment Construction

[0023] exist figure 1 In the preferred embodiment shown, the extraction device according to the invention comprises a conveying device 1 , preferably circular, around which processing stations, not shown, such as testing or micro-welding stations, can be distributed. The movement of said conveying device 1 is preferably indexed, thus defining predetermined positions on its outer edge, at which said processing stations can be arranged. A number of component carriers 11, preferably suction heads, are evenly distributed on the transport device 1, thus allowing the transport of some electronic components from processing stations to other stations. For ease of reading, only one suction head 11 is in the figure 1 shown in .

[0024] One of the positions defined around the conveying device is occupied by a guide flange 3 mounted on a preferably cylindrical vertical support 25, in the center of which a figure 1 Needles, not shown, are used to remove electronic components. With ...

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Abstract

The invention concerns a device comprising at least one extractor for extracting electronic components from a cut out wafer, the extractor(s) being actuated by a linear electromagnetic transducer. The use of a linear electromagnetic transducer, preferably a voice coil motor, for generating movements of the extractor(s) enable the device to achieve very high work rates, not less than those of most existing processing lines. The use of the same motorization for the suction head (11) removing the electronic component to be extracted as for the extractor(s), enables the synchronization of the two movements to be optimized and the quality of the extraction process to be improved.

Description

technical field [0001] The present invention contemplates a method for taking out electronic components from a cut semiconductor board and / or "lead frame", especially for taking out electronic chips and / or for taking out other electronic components, such as leadless packaged components (Leadless Package , LLP) device. Background technique [0002] The electronic chips and LLPs are very small electronic components. The electronic chips are formed in batches on circular semiconductor plates with an overall diameter of 10-30 cm. Other electronic components such as LLPs are themselves usually produced on said rectangular plates called "lead frames". Each board may contain up to several million components, such as chips or LLPs. After production, the electronic components are separated from each other and removed from the board one by one. [0003] According to the principle adopted by most extraction devices, the plate is bonded to an elastic sheet and cut to uniqueize the e...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0408H01L21/67132H01L21/67144H01L21/78
Inventor P·德罗马C·弗鲁瓦德沃
Owner ISMECA SEMICONDUCTOR HOLDING SA
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