Wafer cleaning and drying apparatus

Abstract

The invention discloses a crystal plate wash and dry device. It uses the flow field control of the open type wash tank to generate the disturb flow and keeps the flow speed as normal to obtain the device. The dry device uses liquid volatile solvent (such as alcohol isopropylicum, IPA) to displace water to dry it. It at least comprises a wash tank, an overflow plate with a slope angle, a plurality of overflow ports to dispose the pollution, a plurality of water inlets to form the disturb flow in the wash tank. The vertical water inlet is also a water outlet; it also comprises a plurality of flow control valve to assistant the clean of the crystal plate; the water outlet is controlled by the plurality of flow control valves to keep a certain flow.

Description

technical field [0001] The invention relates to a semiconductor process equipment, in particular to a wafer cleaning and drying device. In particular, the flow field control of the open cleaning tank that feeds water from below is to generate turbulence and use the shape of the discharge port to maintain a constant flow rate for accurate and continuous cleaning and drainage. Background technique [0002] There are open type (open type) cleaning and drying devices, such as figure 1 as shown, figure 1 It is a perspective view of a conventional open washing and drying device 100 . The cleaning tank 102 can be filled with pure water to immerse the wafer. During cleaning, the pure water flows in from the water pipes 104 and 106, and the pure water flows into the tank from the discharge hole 105 of the water pipe to clean the wafer. When the water is full, it overflows from the overflow plate 110. The outlet 112 flows out of the tank and is discharged to a discharge collection ...

AI Technical Summary

Problems solved by technology

But the amount of pure water inflow of this kind of existing device is insufficient, and forms dead angle, and the cleaning effect to wafer is not good, and uneven

However, the overflow port 112 fails to quickly discharge particles and chemicals, which affects the cleaning speed

If you want to increase the water intake, the discharge of overflow water is insufficient, and the overflow water level is uneven, which makes the discharge of particles and chemicals more difficult to control; because the water flows out from the overflow under the water surface, the particles are still on the upper water surface.

If pumping is used for drainage, it will be difficult to control, and the number of equipment will increase. If it is automatically discharged by water pipes, the flow rate will be proportional to the liquid level. As the liquid level decreases, the flow rate will also gradually decrease, which will affect the drainage speed.

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