Intensified component, connector with the component, connection mechanism of electric component and substrate

Abstract

PURPOSE: A reinforcing tap, a connector including the reinforcing tap, and a connecting structure of an electrical component and a board are provided to maintain the connection of the connector and the board even when a large external stress is applied to the connection structure or the connection structure is placed in a high-temperature environment. CONSTITUTION: A reinforcing tap(4) is attached to a housing(3) of a surface mounting connector(1). The housing has a shorter side and a longer side. The reinforcing tap has a portion attached to the longer side of the housing and a portion bonded to a circuit board. The bonded portion has a bonding plane perpendicular to the shorter and longer sides. The bonding plane has the first face parallel with the shorter side of the housing and the second face parallel with the longer side of the housing. The second face is connected to the first face through a curved face to face the housing.

Description

Technical field [0001] The present invention relates to a reinforcement member for enhancing the bonding between a surface-mounted connector in which a pin connector is surface-mounted on a circuit substrate and a circuit substrate. In addition, the present invention also relates to a connection structure for connecting a connector equipped with the reinforcing member, and an electrical component equipped with such a connector or DIP switch to a substrate. Background technique [0002] At present, as a connector to be joined to a circuit board such as a printed wiring board using surface mount technology, a surface mount type connector in which a pin connector is surface-mounted on a wiring pad formed on the surface of the board (hereinafter, It is called "SMT (surface-Mount-Technology) connector." The SMT connector has a housing with an opening into which the counterpart connector is inserted, and multiple pin connectors are arranged side by side at a predetermined pitch in the ...

AI Technical Summary

Problems solved by technology

However, if the bonding area is enlarged, the effective mounting area of ​​the electronic components mounted on the substrate will be reduced

In addition, if a large amount of solder is used, since the wiring pattern of the substrate is very thin, if solder is applied across multiple wiring patterns, poor connection is likely to occur, so it is not preferable.

[0015] In addition, it is conceivable to provide a through-hole on the substrate and to stabilize it by inserting a reinforcing member into the through-hole, but this is not preferable because the effective mounting area of ​​the electronic component on the back side of the substrate will be reduced.

[0016] In addition, sometimes the opposite connector like a game card needs to be pulled out and inserted frequently from the connector. In this case, when the user pulls out the game card from the connector, it is necessary to twist the connector to pull the game card, thus sometimes subjecting the connector to twisting stress

At this time, since the torsional stress is concentrated on the joint between the connector and the board, the joint between the connector and the board may be weakened, causing the above-mentioned problems.

[0017] In addition, the above-mentioned problems are not limited to connectors, but also easily occur on electrical components. Due to manual operation of people, external forces from various directions will be applied to electrical components.

For example, surface-mounted electrical components such as DIP switches that have multiple switches and can produce circuit changes are prone to the above problems

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