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Circuit device

A technology of circuit devices and circuit components, which is applied in the direction of circuits, electrical components, electric solid-state devices, etc., and can solve problems such as inability to form complex circuits

Inactive Publication Date: 2009-04-01
SEMICON COMPONENTS IND LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the above-mentioned circuit device 100, the lead wire 101 only has the function of electrically extending the electrodes of the semiconductor element 104 to the outside, and the lead wire 101 cannot be used to form a rewiring portion or the like.
Therefore, there is the following problem: it is impossible to form a complex circuit inside the circuit device with the lead wire 101.

Method used

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Embodiment Construction

[0019] The present invention relates to a technique for realizing a so-called SIP (single in-line package) with leads capable of wiring in a package.

[0020] Generally, a lead frame has one or two or so islands, around which are arranged inner leads whose ends are close to the islands, and a series of leads formed as electrodes protruding from the package to the outside as outer leads. Then, on each island, a semiconductor chip is provided, and on each electrode of the semiconductor chip, the above-mentioned leads are used for passing input / output signals. That is, the above-mentioned leads are not used for connection between semiconductor elements.

[0021] But there are two exceptions. The first is a stacked multi-chip package in which semiconductor elements are stacked, and the second is a planar multi-chip package in which bridges are provided between islands.

[0022] In the first stack type, leads are effectively used for connection between semiconductor elements. Bu...

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PUM

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Abstract

A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element via fine metal wires and having an end thereof extending outwardly, second leads electrically connected via metal wires to both the first semiconductor element and the second semiconductor element to thus electrically connect the first and second semiconductor elements.

Description

technical field [0001] The present invention relates to a circuit device having lead wires extending to the outside as external terminals. Background technique [0002] refer to Figure 5 , illustrating the structure of a conventional type of circuit arrangement 100 . Figure 5 (A) is a plan view of the circuit device 100, Figure 5 (B) is its sectional view (please refer to patent document 1). [0003] refer to Figure 5 (A) and Figure 5 (B) A land 102 made of a conductive material is formed at the center of the circuit device 100 , and one end of a plurality of leads 101 approaches the periphery of the land 102 . One end of the lead wire 101 is electrically connected to the semiconductor element 104 via a thin metal wire 105 , and the other end is exposed from the sealing resin 103 . The sealing resin 103 has the function of sealing and integrally supporting the semiconductor element 104 , the pad 102 and the lead 101 . [0004] 【Patent Document 1】 [0005] (Japanese) ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/48H01L23/28H01L21/50H01L25/18H01L21/60H01L23/495H01L23/50H01L25/04H01L27/15
CPCH01L23/49541H01L2224/85H01L23/49575H01L2924/19105H01L2924/0105H01L2924/01082H01L2924/00014H01L2924/19043H01L2224/48137H01L24/48H01L2224/48247H01L2924/19107H01L24/85H01L2924/14H01L2924/01005H01L2924/01033H01L24/49H01L2924/01006H01L2924/19041H01L2224/48472H01L23/49589H01L2224/48091H01L2224/49171H01L2924/014H01L2924/13055H01L2224/451H01L2224/85205H01L24/45H01L2924/181H01L2224/05554H01L2224/78H01L2924/00H01L2224/05599H01L2924/00012H01L21/60
Inventor 坪野谷诚涩泽克彦北泽崇
Owner SEMICON COMPONENTS IND LLC
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