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Integrated circuit package and assembling method thereof

A technology for integrated circuits and packages, which is applied in the field of integrated circuit device packaging, and can solve problems such as insufficient heat dissipation performance, electromagnetic interference shielding performance, etc.

Active Publication Date: 2009-04-08
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, current commercial lead frame packages still have deficiencies in terms of thermal performance and electromagnetic interference (EMI) shielding performance.

Method used

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  • Integrated circuit package and assembling method thereof
  • Integrated circuit package and assembling method thereof
  • Integrated circuit package and assembling method thereof

Examples

Experimental program
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Embodiment Construction

[0099] overview

[0100] The present invention relates to apparatus and methods for improving heat dissipation, electromagnetic interference (EMI) shielding, and / or environmental protection in integrated circuit packages. In an embodiment of the present invention, the IC die is mounted on a die tray (DAP) located in the middle of the lead frame, and a plurality of leads are arranged around the lead frame. In one embodiment, the package is configured as a die-up package. In yet another embodiment, the package is configured as a die-down package.

[0101] In one embodiment of the present invention, the metal heat dissipation sealing cap (sealing cap) is connected (for example, electrically connected, structurally connected and / or thermally connected) to the lead frame to form an enclosed structure. In one embodiment, the connection is made with or without a thermally and / or electrically conductive adhesive, such as solder or epoxy containing metal particles or flakes. In ano...

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PUM

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Abstract

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes first and second caps defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. Planar rim portions of the first and second caps that surround the cavity are coupled to the leadframe. The first and second caps and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Description

technical field [0001] The invention relates to integrated circuit (IC) device packaging technology, more specifically, to a device and method for improving heat dissipation performance and electromagnetic interference (EMI) shielding performance in IC device lead frame packaging. Background technique [0002] Integrated circuit semiconductor chips or dies are typically mounted within or on a surface of a package that is mounted on a printed circuit (PCB) board. In the IC package, the lead frame is generally used as the carrier of the IC die and the interconnection between the PCB board circuit and the die. A variety of leadframe packages have been developed in the industry, and the Electrical Industries Alliance (EIA), the Electron Devices Industries Confederation (JEDEC), and the Electrical Industries Alliance of Japan (EIAJ) have also developed standards for the outline of each package family. [0003] However, current commercial lead frame packages still have deficienci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/552H01L23/367H01L21/50
CPCH01L24/97H01L2924/14H01L2224/97H01L2224/32245H01L2924/19107H01L2224/48227H01L2224/48247H01L2924/15311H01L23/552H01L2224/73265H01L2924/3025H01L2924/30107H01L2224/32225H01L24/73H01L2224/48091H01L2924/181H01L2924/351
Inventor 萨姆·齐昆·赵雷泽厄·拉曼·卡恩
Owner AVAGO TECH INT SALES PTE LTD