Chip with projection cube structure

Abstract

The disclosed chip includes chip, weld pads, and lugs. Chip is a microcircuit produced through IC technique. Being as metallized part on chip, weld pads are in use for electrical connection. Being as metal bulges formed on weld pads of chip, lugs are in use for connecting piece of electrical connection between weld pad and end point section of terminal module. Lugs are arranged along transverse direction. Each lug includes first section block and second section block. In long direction, first section block and second section block are connected to each other electrically. The first section block is contacted to weld pad electrically. Size of second section block is larger than size of first section block along transverse direction. Second section block is in use for electrical connection between chip and end point section of terminal module. First section blocks and second section blocks in adjacent lug form staggered arrangement.

Description

technical field [0001] The present invention relates to a chip having a bump structure, in particular to the metal terminals that provide the electrical output of the chip. Background technique [0002] In a known chip with a bump structure, the metallized part formed by the semiconductor process of the chip is used as the chip input / output electrical connection pad, and the bump structure is the metallized part corresponding to the electrical connection to form these Metallized part of the electrical output / input. Usually, in order to cooperate with the probes in the chip testing system, or in order to cooperate with the wire bonding device in the chip packaging process, the bump structure of this type of chip will have a larger plane area to ensure the accuracy of the test or wire bonding. reliability. Due to the progress of current semiconductor manufacturing technology, the line width of the manufactured chips is getting smaller and smaller, so that the pitch of thes...

AI Technical Summary

Problems solved by technology

However, the bump structure cannot be miniaturized due to the limitations of testing or wire bonding devices. Therefore, in view of the limitations of the known bump structure of the chip, the inventors of the present invention want to invent and improve a bump structure, so that the chip's The area can be reduced even more

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