Semiconductor package with contact support layer and method to produce the package

A semiconductor and contact area technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of complex and unreliable methods, achieve simple and fast methods, reliable support, and reduce residual the effect of

Inactive Publication Date: 2009-07-01
INFINEON TECH AG
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method is complex and unreliable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor package with contact support layer and method to produce the package
  • Semiconductor package with contact support layer and method to produce the package
  • Semiconductor package with contact support layer and method to produce the package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] figure 1 Shown is a cross-sectional view of a semiconductor package 1 comprising a semiconductor die 2 mounted to a redistribution board 3 by flip-chip technology.

[0047] Semiconductor die 2 includes an active surface including a plurality of die contact pads 4 and an inactive surface. The redistribution plate 3 comprises a sheet of non-conductive core material 5 and includes a plurality of upper conductive traces 6 and upper contact pads 7 on its upper surface and a plurality of lower conductive traces 8 and external contacts on its bottom surface. District 9. The redistribution plate 3 also includes a plurality of substantially vertical conductive vias 10 electrically connecting the upper contact pads 7 with the contact areas 9 on the bottom surface of the redistribution plate 3 . Solder balls 11 are attached to the external contact areas 9 to provide an electrical connection from the package 1 to an external circuit board (which is not shown in the figure).

[004...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A semiconductor package (1) comprising a substrate (3) comprising a plurality of conductive traces (6) and an upper contact area (7) on its upper surface and a second plurality of lower conductive traces on its bottom surface Wire (8) and external contact area (9), and external conductive means (11) attached to the external contact area (9). The semiconductor package (1) also includes a semiconductor die (2) comprising an active surface having a plurality of die contact pads (4), electrically connected to contact areas (7) of the substrate (3) by conductive means (12) ). The support layer (13) between the conductive means on the active surface of the die (2) covers at least the base part of the conductive means (12).

Description

technical field [0001] The invention relates to a method of manufacturing a semiconductor package comprising a contact support layer. Background technique [0002] DE 101 33 791 A1 discloses a method for arranging and attaching preformed solder balls to a semiconductor chip. This method is complex and unreliable. Contents of the invention [0003] It is an object of the present invention to produce a more reliable semiconductor package and a simple and cost-effective method for producing the package. [0004] This object of the present invention is solved by the following technical solution subject matter. [0005] A method for assembling a semiconductor package of the present invention comprises the following steps: [0006] - providing a wafer comprising a plurality of semiconductor dies, each semiconductor die comprising an active surface having a plurality of die contact regions, [0007] - forming precursor conductive means on the die contact area, [0008] - coa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/485H01L21/68H01L21/56H01L23/31
CPCH01L2924/01015H01L24/12H01L2924/01082H01L2221/68327H01L2224/11003H01L24/94H01L21/563H01L2924/01322H01L2924/15311H01L2224/13099H01L24/11H01L2924/01013H01L2924/014H01L2224/11822H01L2224/32225H01L21/6836H01L2224/274H01L24/27H01L2224/73204H01L24/16H01L21/6835H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01078H01L2224/16225H01L23/3157H01L2224/05571H01L2224/05573H01L2924/00014H01L2224/81011H01L2924/00H01L2224/05599
Inventor K·陈G·奥夫纳李维民
Owner INFINEON TECH AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap