Substrate processing device and method

Abstract

This invention can be used to inhibit steam and mist of processing liquid leak from the inside of a treatment room out of the treatment room. The treatment room is formed in the interior of a chamber 2. The chamber 2 consists of a nonmagnetic material. A spray 3 sprays the processing liquid on the front surface of a substrate 1 in the treatment room. A plurality of shafts 11 are installed at the predetermined spacing in the treatment room. A plurality of rollers 10 are attached in the shaft 11, and a magnet 13 is attached in one end. A motor is installed in the outside of the treatment room, and the shaft 21 is connected with the motor. A plurality of the magnets 23 are attached on the shaft 21 in the position which separates the chamber 2 and counters with each magnet 13. If the magnets 23 rotates by the drive of the motor, the magnet 13 rotates, and the driving force of the motor is transmitted to the roller 10 attached in the shaft 11 by un-contacting through the internal and external spaces of the treatment room.

Description

technical field [0001] The present invention relates to a substrate processing device and a substrate processing method for developing, etching, peeling, cleaning and other substrate processing using processing liquids such as developing solution, etching solution, stripping solution, cleaning solution, etc. A substrate processing apparatus and a substrate processing method for moving a substrate in a processing chamber to process the substrate. Background technique [0002] In the manufacturing process of flat panel displays such as liquid crystal display devices and semiconductor devices, processing liquids such as developer, etchant, stripping liquid, and cleaning liquid are used to coat panel substrates, semiconductor wafers, and other substrates. , for development, etching, stripping, cleaning and other processing projects. Generally, the process of performing these treatments is called a wet process. [0003] In recent years, in wet processing, the substrate is often...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the vapor and mist of the processing liquid leak from the processing chamber to the outside of the processing chamber through the through holes provided on the wall of the processing chamber, thereby polluting the environment around the processing chamber.

In Patent Document 1 and Patent Document 2, a sealing mechanism is provided in the through hole to suppress the leakage of vapor and mist of the processing liquid, but the sealing mechanism is prone to wear due to the rotation of the shaft, and the vapor of the processing liquid cannot be completely prevented. and mist leaks

Images