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Radio-frequency test key structure

A technology for RF testing and components to be tested, applied in electrical components, electrical solid devices, circuits, etc., to achieve the effect of improving accuracy

Active Publication Date: 2009-07-15
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Accordingly, the main purpose of the present invention is to provide a radio frequency test key structure to solve the insurmountable problems of the prior art, and then improve the accuracy of the radio frequency test key structure

Method used

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Embodiment Construction

[0064] Please refer to image 3 and Figure 4 , image 3 It is a schematic diagram of the circuit layout of each layer of the radio frequency test key structure in the first preferred embodiment of the present invention, and Figure 4 for image 3 A schematic top view of the RF test key structure shown. Such as image 3 and Figure 4 As shown, the RF test key structure 50 includes a base 52 , a bottom metal layer 54 , at least one inner metal layer 56 and a top metal layer 58 from bottom to top. The substrate 52 may be a part of a wafer, a silicon-on-insulator (SOI) layer, or a strained silicon (strained silicon) semiconductor substrate including polysilicon, doped polysilicon, and other materials. Moreover, a plurality of crystal grain regions 522 are defined on the substrate 52 and at least one scribe line region 524 is located between the crystal grain regions 522 . The scribe area 524 of the substrate 52 has a long and narrow test area 526 as a predetermined locatio...

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Abstract

The invention comprises: a substrate, a bottom metal layer and a top metal layer. On the substrate, a narrow test area is defined; the bottom metal layer is located in the narrow test area, and the bottom metal layer has an opening used for exposing the component to be tested. The top metal layer is a metal pad located above the bottom metal layer in the narrow test area; wherein, there are at least two signal pad areas and at least two ground pad areas.

Description

technical field [0001] The invention relates to a radio frequency test key structure, in particular to a radio frequency test key structure which can be arranged in a cutting line. Background technique [0002] In a modern information society with highly developed communication systems, radio communication has been widely used in daily life communication between people. People can exchange information, share experiences and communicate opinions anytime and anywhere through convenient radio devices. [0003] As radio is widely used, various radio products are constantly being introduced. In the manufacturing process of radio equipment, in order to maintain the stability of product quality, it is necessary to continuously conduct online testing for the produced radio frequency devices. It makes multiple test key structures on the dicing line of the wafer or on the surface of the monitor wafer, that is, while performing various semiconductor manufacturing processes of radio fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544
Inventor 李岳勋陈正雄郭慈蕙
Owner UNITED MICROELECTRONICS CORP
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