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Surface acoustic wave demultiplexer

A surface acoustic wave and filter technology, applied in electrical components, impedance networks, etc., can solve problems such as difficulty in miniaturizing surface acoustic wave branch filters

Active Publication Date: 2009-07-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is difficult to miniaturize the surface acoustic wave branch filter due to the structure of this filter using welded wires.

Method used

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  • Surface acoustic wave demultiplexer
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  • Surface acoustic wave demultiplexer

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Embodiment Construction

[0045] The present invention will become more apparent from the following description of specific embodiments of the present invention in conjunction with the accompanying drawings.

[0046] figure 1 (a) and 1(b) are an exploded perspective view and a front view, respectively, illustrating a surface acoustic wave branch filter according to a first embodiment of the present invention. figure 2 is a schematic diagram showing the structure of the surface acoustic wave branch filter circuit of this embodiment.

[0047] Such as figure 2 As shown, the surface acoustic wave branch filter 1 has an antenna connection terminal 2 connected to the antenna ANT. Both the transmitting side surface acoustic wave branch filter chip 3 of the first surface acoustic wave branch filter chip and the receiving side surface acoustic wave branch filter chip 4 of the second surface acoustic wave branch filter chip are connected to the antenna connection terminal 2 . The phase matching element 5 ...

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Abstract

A surface acoustic wave demultiplexer in which first and second surface acoustic wave filter chips are mounted by a flip-chip bonding method in a package member, the isolation between the first and second surface acoustic wave filter chips is improved, and favorable attenuation characteristic is achieved. A first acoustic wave filter chip having a low center frequency and a second acoustic wave filter chip (4) having a relatively high center frequency are joined to the chip-mounting surface of a package member (8). A signal wiring pattern (24) is formed on the chip-mounting surface. The bump on the second surface acoustic wave filter chip (4) is joined to the signal wiring pattern (24). A part of the signal wiring pattern (24) is nearer to a ground wiring pattern (25) than the bump.

Description

technical field [0001] The present invention relates to a surface acoustic wave branch filter used as a branch filter such as an antenna section connected to a wireless communication device. Specifically, it relates to a surface acoustic wave branch filter, in which there are first and second surface acoustic wave branch filter chips with different center frequencies in its structure, passing through bumps arranged on the surface acoustic wave branch filter chip Bonds to the wiring pattern provided on the assembly part. Background technique [0002] In recent years, in order to achieve further miniaturization, various branch filters using surface acoustic wave branch filters are being developed to make wireless communication equipment such as portable telephones more compact. [0003] In this type of surface acoustic wave branch filter, first and second surface acoustic wave branch filters having different center frequencies are installed in the form of a combined component...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/72H03H9/25H03H9/05H03H9/145
CPCH03H9/725H03H9/14538H03H9/0576H03H9/72H03H9/6483H03H9/1071
Inventor 谷口典生岸本恭德
Owner MURATA MFG CO LTD
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