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Colophony type non-halide cleaning-free soldering flux for lead-free solder wire
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A lead-free solder, rosin-type technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of solder joint corrosion, excessive residue after welding, etc., and achieve good soldering performance and excellent Welding effect, no irritating smell effect
Inactive Publication Date: 2009-08-26
BEIJING UNIV OF TECH
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[0004] The purpose of the present invention is to provide a kind of higher boiling point alcohols or ethers as a solvent, without Halogen Rosin No-Clean Flux
Method used
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Embodiment 1
[0017] Succinic acid 13
[0018] Polyethylene glycol 2000 5
[0019] Diethylene glycol diethyl ether 10
[0020] Glycerol 12
[0021] Hydrogenated castor oil 3
[0022] Paraffin 2
[0023] Triethanolamine 5
[0024] Octylphenol ethoxylate 2
[0025] polymerized rosin 48
[0026] Specific preparation method: The specific preparation method is a conventional method. First add the solvent in the reaction kettle with a stirrer, add the activator after weighing the reaction kettle, heat and control the temperature at 150 ° C, stir to make it completely dissolve, add polymerized rosin and wait After it is completely dissolved, add stabilizer, paste forming agent, thixotropic agent, surfactant, and then add corrosion inhibitor, stir until the solution is clear and transparent, let it stand, and cool at room temperature, that is, rosin-type halogen-free no-cleaning for lead-free solder wire flux. Then heat the flux and press it into the tin wire with an air press, and finally ...
Embodiment 2
[0028] Adipic acid 15
[0029] Glutaric acid 3
[0030] Octylphenol ethoxylate 0.5
[0031] Polyethylene glycol 2000 6
[0032] Diethylene glycol monoethyl ether 5
[0033] Ethylene glycol 5
[0034] Hydrogenated castor oil 5
[0035] Triethylamine 0.5
[0036] Paraffin 3
[0037] polymerized rosin 30
[0038] Lead-free rosin 27
[0039] Preparation method is identical with example 1.
Embodiment 3
[0041] Sebacic acid 12
[0042] Nonylphenol ethoxylates 4
[0043] Polyethylene glycol 4000 1
[0044] Diethylene glycol monocaprylyl ether 10
[0045] Tetrahydrofurfuryl alcohol 5
[0046] Hydrogenated castor oil 0.5
[0047] Benzotriazole 4
[0048] Paraffin 0.5
[0049] Water white rosin 20
[0050] Fully Hydrogenated Rosin 43
[0051] The preparation method is the same as in Example 1.
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Abstract
The invention relates to a halogen-free no-clean flux for lead-free solder wire, which belongs to the flux field. According to the weight ratio, it is composed of the following materials: organic acid activator 4-18wt%, organic solvent 10-30wt%, paste forming agent 1-6wt%, stabilizer 0.2-3wt%, thixotropic agent 0.5-5wt%, surface active Agent 0.5-4wt%, corrosion inhibitor 0.5-5wt%, modified rosin as the balance. The invention does not contain halogen, has no penetration of the copper mirror after welding, has high insulation resistance, and has good soldering performance, and solves the potential problems caused by excessive rosin content, large smoke and dust, and easy peeling off of residues after welding in the flux used for solder wire in the past. The problem of short circuit of solder joints is stable at room temperature and does not absorb moisture. It does not need to be cleaned after welding, which can meet the needs of general product welding.
Description
technical field [0001] The invention relates to a soldering flux, which is especially suitable for a rosin-type halogen-free no-cleaning flux for lead-free solder wires. Background technique [0002] Soldering is an important process in the assembly process of electronic products. The quality of welding directly affects the performance of electronic circuits and electronic devices. Excellent welding quality can provide good stability and reliability for the circuit, and poor welding methods will cause damage to components, which will bring great difficulties to testing, and sometimes leave hidden dangers, affecting the reliability of electronic equipment. As the complexity of electronic products increases, more and more components are used. Some electronic products (especially some large electronic equipment) use hundreds or even thousands of components, and the number of solder joints is tens of thousands. And a bad solder joint will affect the reliability of the entire p...
Claims
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