Ultraviolet-resistant nano titanium dioxide doped cycloaliphatic epoxy resin LED (light emitting diode) packaging glue

A nano-titanium dioxide, LED packaging technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high hygroscopicity, poor UV resistance, low short-wave transmittance, etc.

Inactive Publication Date: 2012-09-26
SHANGHAI ZHONGXIN YUXIANG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a nano-titanium dioxide-doped alicyclic epoxy resin LED encapsulant with high transparency, good UV aging resistance, strong cohesive force and low hygroscopicity, avoiding the use of high-cost organic silic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] (1) Preparation of Component A: 96.6% 4-vinyl epoxycyclohexane, 2.6% propylene oxide butyl ether, 0.6% softener, 0.14% defoamer and 0.06% transparent blue-violet dye The color paste is weighed according to the proportion, and stirred at 70-90°C for 3-4h until the mixture is uniform;

[0017] ⑵Preparation of component B: a mixture of 98.4% by mass of methyl hexahydrophthalic anhydride and polyazelaic anhydride, 0.97% of tetramethylammonium bromide, 0.5% of glycerol, 0.05% of 20nm titanium dioxide and 0.08% of Tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester is weighed according to the proportion, and stirred at 70-90°C for 3-4h until uniformly mixed;

[0018] (3) A and B components are mixed at a ratio of 1:0.95 for construction.

Embodiment 2

[0020] (1) Preparation of component A: 96.8% 3-oxiranyl-7-oxabicyclo[4,1,0]heptane, 2.5% propylene oxide phenyl ether, 0.5% softener , 0.14% defoamer and 0.06% transparent blue-violet dye paste are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;

[0021] ⑵Preparation of component B: a mixture of 98.4% by mass of methyl hexahydrophthalic anhydride and polyazelaic anhydride, 1% of tetramethylammonium iodide, 0.5% of glycerin, 0.05% of 20nm titanium dioxide and 0.05% of Weigh 2,6-di-tert-butyl-p-cresol according to the proportion, stir at 70-90°C for 3-4h until the mixture is uniform;

[0022] (3) A and B components are mixed at a ratio of 1:0.95 for construction.

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Abstract

The invention relates to an ultraviolet-resistant nano titanium dioxide doped cycloaliphatic epoxy resin LED (light emitting diode) packaging glue which is characterized by comprising a component A and a component B, wherein the components A and B are mixed according to the proportion of 1: (0.9-1.0) and then used for construction; the component A comprises cycloaliphatic epoxy resin, a reactive diluent, a transparent bluish violet dye color paste, a defoaming agent and a flexibility agent; and the component B comprises a curing agent, an accelerating agent, a nano ultraviolet absorbing agent, polylol and an antioxidant. The ultraviolet-resistant nano titanium dioxide doped cycloaliphatic epoxy resin LED packaging glue has the characteristics of high transparency, good ultraviolet ageing resistance, strong binding power and low moisture absorption, avoids adopting organic silicon with high cost, overcomes the defects of high moisture absorption, poor ultraviolet resistance, low short wave transmissivity and the like of the traditional bisphenol A epoxy resin, and is more suitable for being used as an ultraviolet-based white light and blue light LED packaging glue. The ultraviolet-resistant nano titanium dioxide doped cycloaliphatic epoxy resin LED packaging glue has the advantages of good performance, low cost and simple process, and is suitable for industrial massive production.

Description

technical field [0001] The invention relates to an LED encapsulation glue, in particular to an LED encapsulation glue doped with nano-titanium dioxide and alicyclic epoxy resin with good ultraviolet aging resistance. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, are widely used in lighting, radiation sources, and displays because they have advantages in all aspects compared with incandescent lamps and fluorescent lamps. During the use of LEDs, the photons generated by radiative recombination will be lost when they are emitted outwards, and a lot of light cannot be emitted from the chip to the outside. By coating the surface of the chip with a transparent adhesive layer with a relatively high refractive index, that is, encapsulation adhesive, since the adhesive layer is between the chip and the air, the loss of photons at the interface can be effectively reduced and the light extraction efficiency can be imp...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04H01L33/56
Inventor 曹祥来孔庆茹乔毅
Owner SHANGHAI ZHONGXIN YUXIANG CHEM
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