Method for explosive synthesizing nano polycrystal diamond and special-purpose explosive device

Abstract

The invention discloses an explosive synthesis method of 30-90nm polycrystalline diamond suitable for chip polishing with simple production process and high production efficiency. The method comprises the following steps: making the density 3-4g / cm3; Under the explosive device with a thickness of 4.7-6mm, the height of the flyer is 50-65mm; when the explosive device is detonated, the explosive velocity of the explosive column of the explosive device should make the flyer hit the graphite compacted body at a flying speed of 3350-3640m / s; powder Pressure p and powder temperature T meet the following requirements (calculated according to Debye theory): 5×104MPa≤p≤7.5×104MPa, 1900K≤T≤2150K; graphite ash is recovered, screened, washed and chemically post-treated. The explosive device is provided with an explosive column (1), a flyer (2) is arranged under the explosive column (1), a detonating detonator (3) is arranged on the top of the explosive column (1), and the inner upper end of the explosive column (1) is centered An inert block (4) is provided.

Description

Technical field: [0001] The invention relates to a diamond production method, in particular to an explosive synthesis method of 30-90nm polycrystalline diamond suitable for chip polishing. Background technique: [0002] Diamond has become an ideal material for grinding and polishing because of its "hardest in the world" feature. Due to the scarcity and high price of natural polycrystalline diamond (Carbonado type), artificial diamonds are commonly used now. At present, there are only three methods for artificially manufacturing diamonds: static pressure method, detonation method and explosion method. The diamonds produced by the static pressure method are all single crystals, and the particle size is usually between 40 and 200 μm, which is suitable for making ordinary diamond grinding wheels and common polishing abrasives; the diamonds produced by the detonation method are also single crystals, and the average particle size is very small , usually around 12nm, the agglomera...

AI Technical Summary

Problems solved by technology

Because the inert block is placed outside the explosive column and covered on the entire explosive column, the edge of the flyer is convex and the center is concave, which increases the impact force on the center of the graphite compacted body, causing uneven force on the graphite compacted body. Diamond yield is low

[0005] With the high density of integrated circuits, chip lithography lines are getting thinner and thinner, and the requirements for chip flatness are getting higher and higher. The existing chemical mechanical polishing and grinding technology can no longer meet the needs of chips. Chip polishing materials with a diameter of 30-90nm

For this reason, some of the coarse-grained diamonds produced by the static pressure method are pulverized and then made into a suspension, and some of the small-grained diamonds produced by the detonation method are artificially bonded and redispersed, but there are production processes The polycrystalline structure of Carbonado diamond, which is complex and not original polycrystalline, is not self-sharpening and prone to chip scratches during polishing and grinding

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