Filter and its coil arrangement frame

Abstract

The invention provides a filter, which mainly includes at least one coil wire management frame, multiple coils accommodated in the wire management frame and a circuit board. The wire management frame has a first side and a second side opposite to the first side, a plurality of first pins are provided on the first side, and are electrically connected with the first circuit board, and a plurality of first pins are provided on the second side. There are a plurality of second pins electrically connected to an external electronic device or component, wherein both the first pins and the second pins are connected to the coil. The wire management frame also includes an electrical connection part, which extends from the first side to the second side, wherein the electrical connection part has a plurality of connecting pins, which pass through and protrude from the first side and the second side, and can be used The pins or external electronic components on the first circuit board and the second side are electrically connected.

Description

technical field [0001] The present invention relates to a filter and its coil wire management frame, in particular to a filter and its coil wire management frame which can be replaced by a single module and can be modularized to replace the traditional one. Background technique [0002] With the refinement of electronic information products, most of the technologies for connecting electronic components to printed circuit boards are surface-mounted (SMD). Traditional magnetic components generally have the following two methods in practice. [0003] One method is to wind the copper wire on the iron core to form a coil, and solder it on the pad (PAD) of the circuit board with a manual soldering iron; at the same time, attach the SMD component to the circuit board; The pins are soldered into the preset pin holes on the circuit board; the coil is covered with silicone; finally, the entire circuit board and the components on it are encapsulated with epoxy resin. [0004] Another ...

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Problems solved by technology

[0005] However, there are still several problems to be solved in the above two methods. For example, in the above-mentioned first method, with the continuous improvement of the integration of coils, more and more coils need to be welded, and the difficulty of manual work The degree of welding has also increased, and the skill requirements of manual workers have been relatively increased; and even with good manual welding technology, it often takes repeated operations many times to ensure that several coils are welded at one time, making the product more reliable. and reliability are greatly reduced, and labor-intensive and time-consuming

In addition, the plug-in connection of the external connection is manual soldering. As the integration level increases, the number of pins also increases, which increases the difficulty of manual soldering of the pins, which may easily cause the defects of different pin lengths or skewed pins.

As for the dispensing amount of silica gel, the amount of dispensing is likely to be unstable due to manual dispensing, resulting in unstable characteristics of the finished product.

When potting, if the proportion of the sealant used is wrong, it will cause poor potting and affect the characteristics and appearance

[0006] In the above-mentioned second method, when molding the SMD transformer module, solder with high lead content is used inside, which cannot meet the requirements of environmental protection

Moreover, due to the high integration of components in today's electronic products, the space of the transformer module is greatly compressed in the limited space, resulting in poor reliability of the transformer module, low process yield, and high cost. When the client uses it, the failure rate Big

Similarly, limited by the limited space of the circuit board, the distance between the capacitor on the circuit board and the pin (PIN) of the transformer module becomes very small, there is a possibility of electrical failure, and the withstand voltage characteristic becomes poor.

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