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Polishing composition

A technique of polishing composition and weight, which is applied in the field of polishing composition, and can solve the problems of not being able to fully improve the smoothness of the surface of the substrate and reduce the effect of micrograin on the surface of the substrate.

Inactive Publication Date: 2009-10-07
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this polishing composition still has a problem: Although succinic acid or succinate accelerates polishing and prevents defects existing on the surface of the polished substrate, succinic acid or succinate is less effective in reducing micrograining on the surface of the substrate. Slight, and does not sufficiently improve the smoothness of the substrate surface

Method used

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  • Polishing composition

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Embodiment Construction

[0009] A specific embodiment of the present invention will be described below.

[0010] According to this embodiment, the polishing composition contains: (a) abrasive, which contains at least one selected from the following components: aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, silicon carbide, nitride silicon; (b) a polishing accelerator containing at least one of the following components: carboxyethylthiosuccinic acid, carboxyethylthiosuccinate; and (c) water.

[0011] The polishing composition can be used to polish objects such as disk substrates. The substrate can be formed by placing an electroless nickel-phosphorous coating on an aluminum alloy blank, or it can be nickel-iron, boron carbide, or carbon. substrate.

[0012] The abrasive acts during the mechanical polishing of the object, and the abrasive preferably contains at least one of alumina or silica. Alumina is more preferably contained. Alumina and silica are very effective ...

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Abstract

The present invention relates to a polishing composition more suitable for use in polishing a substrate for a magnetic disk. The polishing composition contains an abrasive which contains at least one component selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide; silicon carbide, and silicon nitride, a polishing accelerator which contains at least one component selected from the group consisting of carboxyethyl thiosuccinic acid and its salts, and water. The polishing accelerator may further contain other components e.g. malic acid, citric acid. Also shown is a method of polishing a substrate using the above polishing composition.

Description

technical field [0001] The present invention relates to a polishing composition for polishing a substrate such as a magnetic disk or the like. [0002] A magnetic disk used as a hard disk serving as a computer storage element is required to have a high recording density. Therefore, the substrates used in magnetic disks are required to have good surface properties. Background technique [0003] Japanese Patent Publication No. 2000-1665 discloses an improved polishing composition to meet the above requirements for substrates. This polishing composition contains: an abrasive (such as alumina), succinic acid or succinate (as a polishing accelerator), and water. [0004] However, this polishing composition still has a problem: Although succinic acid or succinate accelerates polishing and prevents defects existing on the surface of the polished substrate, succinic acid or succinate has little effect on reducing micrograining on the surface of the substrate. Slightly, and cannot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02B24B37/00C09K3/14C09K13/04C09K13/06G11B5/84
CPCC09G1/02C09K3/1409G11B5/8404C09K3/1463
Inventor 石桥智明大胁寿树
Owner FUJIMI INCORPORATED
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