The invention relates to a
copper printed circuit board cleaning agent prepared from the raw materials of, by weight: 1-2 parts of
copper sulfate, 2-3 parts of
sodium carbonate, parts of 1-2
sodium gluconate, 2-4 parts of
citric acid, 30-35 parts of
acetone, 1-2 parts of
sodium dodecyl benzenesulfonate, 3-4 parts of coconut
oleic acid monoethanolamide, 3-4 parts of dioctyl sodium sulfosuccinate, 4-5 parts of an auxiliary agent, and 100-120 parts of deionized water. The
cleaning agent adopts various surfactants such as anionic surfactants and nonionic surfactants, and is an
emulsion formed with water. The
cleaning agent has excellent dissolving capacity upon
rosin and organic compounds, and has good cleaning effect.
Copper sulfate is adopted, and a protective effect is provided for a circuit board. With the cleaning agent, the circuit board is prevented from being corroded. The water-
emulsion cleaning agent has the advantages of low cost, environment friendliness, no
pollution, and direct
discharge. With the auxiliary agent, a protective film can be formed on the surface of the circuit board, such that air is isolated, and the circuit board is prevented from being corroded by water and other molecules in the
atmosphere. With the cleaning agent, oxidation and short-circuit can be prevented, and the next step of manufacturing process can be conveniently carried out.