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Switch module and single-pole double-throw module in wireless communication

A wireless communication and switch module technology, applied in electronic switches, electrical components, transmission systems, etc., can solve the problems of limited benefits of miniaturization and inability to effectively reduce the use area of ​​circuit boards, and achieve the effect of reducing costs

Inactive Publication Date: 2009-10-14
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The RF switch is composed of several ICs and passive components. The current limited passive components of the RF switch are surface mount components. Therefore, even if the circuit layout is changed, the usable area of ​​the circuit board cannot be effectively reduced, which is of limited benefit to the miniaturization of the product.

Method used

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  • Switch module and single-pole double-throw module in wireless communication
  • Switch module and single-pole double-throw module in wireless communication
  • Switch module and single-pole double-throw module in wireless communication

Examples

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Embodiment Construction

[0046] Embodiments of the present invention are described in detail as follows with schematic diagrams. When describing the embodiments of the present invention in detail, the part representing the build-up multilayer board will be enlarged and shown for illustration, but this should not be regarded as a limited cognition. In addition, other necessary parts of this structure can be included in the actual build-up multilayer board.

[0047] Secondly, when each element or structure in the drawings of the embodiments of the present invention is described as a single element or structure, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on number, this The spirit and scope of application of the invention can be extended to structures and methods in which multiple elements or structures coexist.

[0048] Figure 1A Shown is a front perspective schematic diagram illustrating the first embodiment ...

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Abstract

The disclosed switch module and single-pole double-throw module for wireless communication is composed of a multi-layer board structure with increased layers, and passive elements. The multi-layer board structure with increased layers possesses multiple conducting layers and multiple dielectric layers superposed each other. There is at least any one dielectric layer between any two conducting layers. A passive element is as part of at least one conducting layer, and is electrical connected to multiple current conducting pads on at least one surface of multi-layer board structure with increased layers. The invention integrates capacitance, inductance and resistance etc, passive elements needed by switch circuit in radio frequency onto multi-layer board. Being applicable to front end module in radio frequency in electronic products of wireless communication, the invention reaches to purposes of lowering cost, and miniaturization.

Description

technical field [0001] The invention relates to a structure of a wireless communication switch, and in particular provides a switch module and a single-pole double-throw module for wireless communication using a build-up multilayer board to make a radio frequency switch. Background technique [0002] Low cost and miniaturization have become one of the important goals of wireless communications, digital computers, and portable electronic products. For example, the RF switch of the RF Front End Module controls the selection of the antenna, the switching between the antenna end and the receiving end, and the switching between the antenna end and the transmitting end, so it is one of the key components of wireless communication. [0003] The RF switch is composed of several ICs and passive components. The current limited passive components of the RF switch are surface mount components. Therefore, even if the circuit layout is changed, the usable area of ​​the circuit board canno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03K17/00H04B1/40H03K17/74
Inventor 魏昌琳翁卿亮卓威明赖颖俊余迅陈昌升
Owner IND TECH RES INST