Method for suppressing plasma unstable
A plasma and stable technology, applied in the field of plasma stabilization, can solve the problems of complex operation and rising cost
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Embodiment 1
[0033] In the RF inductively coupled plasma etching process, the working conditions of the plasma device used are as follows:
[0034] RF power 300W
[0035] Working pressure 5-20mTorr
[0036] N 2 Flow rate 100 standard ml / min (SCCM)
[0037] Ar flow 3 SCCM.
Embodiment 2
[0046] Using the same RF inductively coupled plasma device as in Example 1, the working conditions are as follows:
[0047] RF power 100-1000W
[0048] Working pressure 20mTorr
[0049] o 2 Flow 100SCCM
[0050] Ar flow 5 SCCM.
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